国家/地区 中国（29）
IPC部 C（29） H（29） B（5）
IPC大类 C08（29）
IPC小类 H05K（29）
IPC C08K003/04（23） H05K009/00（17） H05K007/20（8）
C08J005/18（7） C08K003/08（7） C08K003/22（7）
C08L023/12（7） C08L063/00（6） C08K003/36（5）
C08K007/06（5） C08K009/06（5） B32B027/06（4）
C08L023/08（4） C09K005/14（4） B32B027/20（3）
发明人 LIU S（3） ZHANG J（3） BAI Y（2）
CHEN C（2） CHEN L（2） GAO D（2）
HE J（2） HU B（2） LIU Y（2）
LV Y（2） NIE J（2） QUAN H（2）
REN Y（2） WANG S（2） WANG Z（2）
公开年 2023（29）
申请年 2022（20）  2023（6）  2021（3） 
专利权人 BEIJING RES .（2） CHANGSHU SHE.（2） CHINA PETROL.（2） SHENGYI TECH.（2）

Low dielectric composite heat dissipation sheet comprises polymer heat radiation sheet layer, first adhesive layer, first ceramic film layer, second adhesive layer, first insulating layer, third adhesive layer, and second insulating layer.

YOO T H, PARK M W, WOO Y H, HWANG S H, HUANG S, YUN H, PARK M, LIU T

Aramid nanofiber wave-absorbing honeycomb material used in stealth aircraft, stealth ships and communication base stations, comprises para-aramid fiber nanofibers and wave-absorbing agent.

ZHANG J, NIE J, TAN J, SONG S, ZHANG M, SUN H, YANG B

Heat dissipation film has two-dimensional heat conduction elements assembled in orientation, and is prepared by dispersing two-dimensional heat conduction elements and gel components in water, placing planar substrate that can release charged particles in assembly liquid, and assembling element.

GAO W, ZHAO N, WU Y, BAI H

Plug hole resin with low temperature resistance and high thermal conductivity used in circuit board production technology, e.g. deep sea, deep space and polar detection field comprises epoxy resin, reactive diluent, latent curing agent, imidazole curing accelerator, antifoaming agent, and filler.

LI Q, YANG X, JIANG M, ZHANG Z, HE Z, HU B, DENG W, CHEN L

Preparing wave-absorbing material comprises dispersing graphene oxide and polyaniline in water to obtain solution A, dissolving divalent iron salt and trivalent iron salt in water and mixing with solution A, heating, adding reducing agent, centrifuging, dispersing composite material in water.

LUAN X, YUAN X

Heat dissipation material used in heat dissipation of heat generating devices, comprises graphene, silver nanoparticles and polyvinylidene fluoride, where graphene vinyl is modified and dispersed in polyvinylidene fluoride, and silver nanoparticles are adsorbed on graphene surface.

HU B, GUO H, LI B

Preparing plant fiber-based microwave absorber involves using plant fiber as raw material, placing in heating chamber of heating device, passing inert gas to heating chamber, increasing temperature, carbonizing plant fibers, cooling heating chamber, pulverizing, and compounding with polymer matrix.

SUN C, PAN L

Preparing multilayer porous electromagnetic shielding composite foam material with adjustable heterogeneous structure comprises e.g. adding carbon nanofillers and aqueous polyurethane to deionized water, fully stirring, and dispersing under ultrasonic action of cell crusher.

LIU S, WANG S, WANG Z, YANG J

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Antistatic polypropylene composite film useful in packaging materials, comprises at least first film layer formed from a polypropylene composition and second film layer formed from a polypropylene composition.

BAI Y, XU K, CHU L, LV Y, REN Y, GAO D, XU M, QUAN H