国家/地区 日本（17）
IPC部 C（17）
IPC大类 C08（17）
IPC小类 C08K（17） C08L（16） C08G（7）
C08J（7） C09K（5） B82Y（4）
C01B（4） C09C（4） H01L（4）
B32B（3） H05K（3） B29C（2）
B33Y（2） B60C（2） C09D（2）
IPC C08K003/013（17）
发明人 ALKA A（2） ALKAN A（2） ALKANE A（2）
BAYER A（2） CADALBERT A（2） DALBERT A（2）
HOFFMANN B（2） IFTIME G（2） JUNHUA W（2）
PANDEY R（2） WEI J（2）
公开年 2021（11） 2022（5）
申请年 2020（8）  2021（6）  2019（3） 
专利权人 EMSCHEM AG（3） FUJI POLYMER.（2） PALO ALTO RE.（2）

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Resin composition used in elastomeric material for thermally conductive material and heat radiating material, comprises polyacrylate resin comprising acrylate monomer, preset amount of silica particles and thermally conductive filler, and has preset thermal conductivity determined by flash method.

ASAI F, TAKEOKA N, SEKI T

Polyamide molding composition used as a filled polyamide molding for producing moldings or components of automotive sector, comprises partially crystalline and aromatic polyamide, functionalized impact modifier, metallocene, and additive.

ALKAN A, CADALBERT A, BAYER A, HOFFMANN B, ALKANE A, DALBERT A, ALKA A

Polyamide molding compound used for forming e.g. component of engine compartment of automotive application, comprises partially crystalline, partially aromatic polyamide and/or caprolactam-containing polyamide, filler, optionally substituted metallocene, and additive.

ALKAN A, CADALBERT A, BAYER A, HOFFMANN B, ALKA A, ALKANE A, DALBERT A

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K

Intermediate film used for laminated glasses for automobiles, railroad vehicles, aircraft, ships, and buildings, contains pigment.

NOHARA A, CHOU K, NAKAYAMA K, OKAJIMA M, CHOW K, MOYURU O A, ZHANG J, YE Y

Elastomeric composition for manufacturing articles, contain carbon nanostructures or their fragments comprising multiwalled carbon nanotubes crosslinked into branched, interdigitated, entangled and/or common wall-sharing polymeric structure.

CHEN L, LI J, KYRLIDIS A, DOSHI D A, ZHANG P

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Filament material for marking three-dimensional (3D) printed object, has polymer resin (compatible with extrusion based printing process), and marking additive that allows portions of filament material to change color when exposed to light.

HU N X, HU N