国家/地区 台湾（25）
IPC部 C（25） H（25） B（11）
G（4） F（2）
IPC大类 C08（25）
IPC小类 H01L（25）
IPC C08K003/04（10） C01B031/04（6） C08J007/04（5）
C09K005/14（5） H01L023/373（5） H05K007/20（5）
B82Y040/00（4） C01B031/02（4） C08K003/08（4）
C08K003/22（4） C09J011/04（4） C01B032/182（3）
C07C025/18（3） C08G061/10（3） C08K003/013（3）
发明人 FENG X（3） HENCKENS A（3） MUELLEN K（3）
MULLEN K（3） ESTRUGA O M（2） ESTRUGA ORTIGA M（2）
ESTRUGAORTIGAMARQUE（2） FASEL R（2） RUFFIEUX P（2）
SCHWAB M G（2）
公开年 2022（7） 2021（5） 2014（3） 2015（2） 2016（2） 2018（2）
申请年 2020（5）  2021（5）  2013（4）  2015（2）  2018（2） 
专利权人 BASF SE（3） HENKEL AG C.（3） MAX PLANCK G.（3） BASF CHINA C.（2）
FUJI POLYMER.（2） WISCONSIN AL.（2）

Transferring one or more nanostructures from one substrate to another substrate by applying coating of crosslinkable copolymer over one or more nanostructures on surface of substrate, heating, transferring nanostructures and copolymer onto another substrate surface, and removing copolymer.

ARNOLD M S, JACOBBERGER R M, GOPALAN P, DWYER J H

Condensation curable composition for use in cured silicone-imide material for article in aerospace device, electronic device, electronic component, automobile, insulation, coating, or solvent resistant membrane, comprises silicone-imide base polymer, crosslinker, and condensation cure catalyst.

KONWAR D B, FUJIMOTO T, MANDAL S

Adhesive film for producing structure e.g. heat-dissipating substrate, is formed of adhesive resin composition that contains thermally conductive filler composed of at least one of graphene having two-dimensional structure and single-walled boron nitride, thermosetting component and binder polymer.

ISAO I, TAKEO Y, ICHIKAWA I, YOSHINOBU T

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Electrically conductive one-component epoxy adhesive composition for e.g. solar cell comprises epoxy resin, at least one ionic constituent as catalyst for epoxy homo-polymerization, electrically conductive particles, and inorganic particles.

POELLER S, WUCHERPFENNIG S, ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, STEINKOGLER S, ESTRUGAORTIGAMARQUE, POHL S

Heat-conductive silicone heat radiation material used as thermal interface material between heating portion of electronic component and heat sink comprises silicone polymer, heat-conductive inorganic filler, and heat-resistance improver.

KOBAYASHI S, KIMURA Y, SHINGO K, YUKO K

Manufacture of electrically responsive structure of graphene-polyvinylidene fluoride film involves adding graphene powders into mother solution of polymer, and removing solvent from slurry to directly form film.

HUNG W S, HUANG J X

Resin composition useful in electronic component for communication, comprises molded portion having electromagnetic wave absorber.

UCHIDA K, TSURUMI H, TSURUMI K, NEI T, HIROKAZU T

Polymer composition used for forming substrate for electronic device, comprises liquid crystalline polymer, electroconductive filler, and mineral filler, and has preset surface resistivity.

KIM Y S, JIN R

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y