国家/地区 中国（18） 日本（6） 韩国（6） 美国（6） 世界知识产权组织（5） 欧洲专利局（EPO）（3） 台湾（3）
IPC部 C（21）
IPC大类 C08（21）
IPC小类 C08L（21） C08K（19） H05K（13）
C09D（12） C08J（10） C09K（9）
H01L（6） C08G（5） H01B（5）
C01B（4） B32B（3） H01M（3）
H05B（3） B82Y（2） C09J（2）
IPC C08L063/00（21）
发明人 CHI S（2） CHOI S（2） JI S Y（2）
KIM S（2） KIM S H（2） WANG N（2）
公开年 2021（5） 2022（4） 2018（3） 2012（2） 2020（2）
申请年 2020（6）  2021（4）  2012（2）  2018（2） 
专利权人 SAMSUNG ELEC.（2）

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K

Epoxy resin composite material, has multiple fluorinated graphene films located in epoxy resin base body, where multiple fluorinated graphene films orderly arranged along thickness direction and along length direction of epoxy resin base body.

PAN Z, ZHOU M

Composition used in electronic component for shielding electromagnetic waves, comprises silver particles, resin and alkoxysilane compound.

TAKASHI Y, YONEDA T

Graphene film, which is not calendered, and graphene film has airtight bubble structure.

WANG N

Electroconductive composition used as interconnection material, contains resin component containing functionalized polybutadiene, electroconductive filler, curative, core-shell rubber toughener, epoxy reactive diluents and curing agent.

ESTRUGA ORTIGA M, HENCKENS A, ESTRUGA O M, ESTRUGAORTIGAMARQUE

Preparation of graphene insulating and thermally conductive sheet for electric vehicle power supply, involves e.g. coating surface material on surface of middle layer, and hot pressing to form surface layer of thermal conductive sheet.

JIA T, HONG W, ZHOU R, XI X, YANG F, LI M

Flexible metal-based graphene electric heating material, comprises flexible insulating layer, flexible graphene resistance layer, flexible insulating layer, and metal substrate arranged sequentially from top to bottom.

LI Y, LOU M

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Graphene multilayer circuit board heating chip comprises epoxy resin glass fiber plate as substrate layer, electrode layer connected with graphene layer, and epoxy resin glass cloth as top layer.

CHEN L

Preparation of graphene reinforced thermal conductive composite film for electronic product, involves punching graphene film to form graphene film with closed bubble structure, coating fluidity-adjusted polymer on graphene film and curing.

WANG N