国家/地区 韩国（10）
IPC部 C（10）
IPC大类 C09（10）
IPC小类 C09D（10）
IPC C09D007/61（5） C08K003/04（4） B82Y030/00（2）
B82Y040/00（2） C09D007/40（2） C09D163/00（2）
C09D175/04（2） G09F009/30（2）
发明人 CHOI S（10）
公开年 2022（4） 2023（3）
申请年 2021（5）  2020（2） 
专利权人 CHEORWON PLA.（2） LG DISPLAY C.（2）

Producing coating agent used for devices, comprises e.g. preparing graphite interlayer material through electrochemical pretreatment of graphite, preparing exfoliated graphite, and preparing graphene composite through secondary exfoliation.

KYOUNGJEONGBAE, SU Y C, HWAN B J, CHOI S, BYUN G, CHOI E J

Manufacture of powder coating composition for electrostatic powder coating, involves hydrolyzing jute, treating with agent comprising ammonium hydroxide and calcium sulfite, bleaching, obtaining jute-derived graphene, performing dispersion treatment, melting, and pulverizing melted material.

CHOI S

Composition used in production of heat-dissipating paint, comprises binder resin comprising urethane resin or epoxy resin, thermally conductive particles comprising expanded graphite particles having preset diameter and metal particles, additives comprising anti-settling agent, and solvent.

HUN L S, SONG J, CHOI S, YUMINSOOK, KIMTAEHAN, LEE S H, SONG J H, CHOI S I, YU M S, KIM T H

Protective film used in display apparatus comprises light shielding layer disposed in edge portion of one surface of substrate, where light shielding layer comprises first layer on edge of one surface of substrate and second layer on first layer.

CHOI S, JEON H, CUI S, JEON H M

Graphene composite useful in an ink composition for printed electronics comprises graphene, transition metal nanoparticle and silver, where the transition metal nanoparticle carbide-bonded to surface of graphene.

CHOI S, SHIN M S, LEE S J, YEON J, OH S T

Manufacturing carbon material doped with nitrogen and sulfur, comprises adding carbon solid raw material, solid raw material containing nitrogen and solid raw material containing sulfur into thermal plasma reactor, and introducing ammonia.

CHOI S, SONBYUNGKOO, SHIN M S, LEE K, LEE S J, YEON J, OH S T

Cooling of semiconductor component for e.g. heat sink, involves arranging metal layer between component and heat dissipation coating layer, forming coating layer by using heat dissipation coating composition containing urethane binder resin, and exfoliating thermally conductive particles.

KIMTAEHAN, HUN L S, CHOI S, SHIM Y, SONG J, KIM T H, LEE S H, CHOI S I, SIM Y H, SONG J H

Foldable display device e.g. in TV comprises e.g. heat dissipation substrate disposed on support substrate, including copper and their alloy and heat dissipation coating layer on surface of heat dissipation substrate, includes base resin.

LEE K H, CHOI S, LEE M

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Antistatic film, useful e.g. as transparent or semitransparent antistatic films, comprises conductive particles comprising single-layer or multi-layer graphene and binder.

KOO C M, HONG S M, HWANG S S, KWAK S, BAEK K Y, MIN K H, PARK Y D, KWAK H L, KIM M H, KIM B R, CHOI S, HAN T H, CHOI S S, KWAK S J