国家/地区 中国（7） 韩国（3）
IPC部 C（11）
IPC大类 C08（11）
IPC小类 C08K（11）
IPC C09J011/04（11）
发明人
公开年 2023（11）
申请年 2022（6）  2021（4） 
专利权人

High-barrier heat-resistant solvent-free polyurethane composite material useful as film lamination in packaging composite field of e.g. daily chemical, comprises e.g. polyurethane prepolymer, graphene modified polyol, polyester polyol, nano-silicon dioxide modified polyether polyol and isocyanate.

HE C, TIAN L, WEN Y

Processing wire-drawing aluminum-plastic composite plate useful in household decoration field, comprises e.g. mixing octafluoropentanol and tetrahydrofuran solution, stirring, mixing hexachlorocyclotriphosphazene, reacting, melting, extruding, molding, adhering adjacent plates and hot pressing.

QIAN C

Preparing high-temperature-resistant flame-retardant expanded polystyrene foam board comprises uniformly mixing and stirring to become main ingredient including melamine resin, and high temperature resistant filler, and pasting the two load-bearing boards on both sides of the composite board.

HE Y, RUAN X

Photothermal conversion anti-corrosion adhesive tape in e.g. outdoor steel structures, comprises transparent protective layer resin including silicone resin, polyurethane resin or fluorocarbon resin, and photoelectric layer material including cadmium telluride or selenium-doped cadmium telluride.

PAN X, YANG H, CHEN F

Hot melt adhesive composition for encapsulating electronic devices, preferably located under bonnet of vehicle or in medical devices comprises at least one aliphatic semi-crystalline copolyamide and at least one thermally conductive filler.

PRENVEILLE T

Electrically conductive solvent cement used for coupling thermoplastic components comprises thermoplastic resin, solvent for dissolving the thermoplastic resin, and electrically conductive material.

LI Q, DAIGNEAULT L, MARTINO F

Polymer layer derived composition useful in a display device, comprises e.g. polyborondimethylsiloxane, benzoyl peroxide, fumed silica, glass fibers, glass powder, carbon nanotubes, graphene oxide, carbonyl iron, calcium carbonate, zinc oxide, silicone elastomer and polydimethylsiloxane.

HWANG S, LEE J, WU X, KIM J, KIM Y, SHIN H, YU W, YU W R, SHIN H J, SONG K Y, KIM J S, OH H J

Flexible heat-dissipating adhesive sheet comprises thermally conductive adhesive layer formed on one surface of copper sheet and graphene layer formed on other surface of copper sheet in which graphene and synthetic resin are mixed.

HEE L J, HEE L Y, CHOIJINHO

Repairable hydrogel composition useful for adhesives and metal substrates, comprises aromatic substituent based acrylate compounds and polyvinyl alcohol.

DU L, LIU B, DENG F, DOU J

Heat dissipation adhesive sheet useful in electronic components e.g. semiconductors, or PC boards comprise metal thin film layer formed on lower surface of heat dissipation layer, and adhesive layer on metal thin film layer.

HUN L S, SONG J, KWON H J, CHOI S, YUMINSOOK, YOUK S K