国家/地区 中国（7）
IPC部 C（7）
IPC大类 C23（7）
IPC小类 C23C（7）
IPC C23C016/02（7）
发明人 ZHANG Z（7）
公开年 2020（4） 2015（2）
申请年 2019（4）  2014（2） 
专利权人 CHINA DONGFA.（4） CHANGZHOU 2D.（2）

Board comprises first copper foil, graphene layer and second copper foil, second copper foil is electroplated copper.

LIU K, DING Z, ZHANG Z, KOU J, HUANG Z, YUE X, CHEN Y, WANG E

Preparing graphene-coated copper alloy composite material involves cleaning copper alloy as base, then chemically removing impurities with dilute hydrochloric acid, cleaning and drying, and placing processed copper alloy.

ZHANG Z, YANG D, HE P

High temperature coating of graphene anticorrosive layer of copper alloy composite material comprises cleaning copper alloy surface, soaking in dilute hydrochloric acid, heating with hydrogen gas, decomposing and coating graphene.

ZHANG Z, YANG D, HE P

Graphene heat-dissipation film-containing alloy material used for e.g. heat-transfer component of electronic equipment, substrate made of copper alloy, iron alloy or aluminum alloy, and graphene film which covers surface of substrate.

ZHANG Z, YANG D, HE P

High temperature coating of graphene anti-corrosive layer on stainless steel composite material involves performing copper or nickel plating on steel surface, heating processed steel, passing gas and coating graphene on steel surface.

ZHANG Z, YANG D, HE P

Preparing graphene thin films comprises processing copper foil blank and growing graphene films on copper foil where processing copper foil blank includes e.g. cleaning copper foil blank plasma, decontaminating and treating with oxide layer.

JIN H, LIU Z, QI X, PENG P, YANG H, ZHANG Z, ZHANG W, ZHANG X, DENG K

Growing graphene thin film on copper foil involves subjecting copper foil to plasma cleaning, de-contaminating copper foil, removing oxidation layer from copper foil, electrochemically polishing copper foil.

JIN H, LIU Z, QI X, PENG P, YANG H, ZHANG Z, ZHANG W, ZHANG X, DENG K