国家/地区 台湾（7）
IPC部 C（7）
IPC大类 C23（7）
IPC小类 C23C（7） H01L（5） C01B（4）
B32B（2） H01J（2）
IPC C23C016/26（7）
发明人 GLASS H（2） GUINEY I（2） THOMAS S（2）
TYLER M（2） WALLIS R（2）
公开年 2021（7）
申请年 2020（7）
专利权人 EV GROUP THA.（2） PARAGRAF LTD（2）

Carrier substrate for transferring transfer layer from carrier substrate to product substrate, comprises carrier base substrate, protective layer, and transfer layer grown on protective layer.

BURGGRAF J, JUERGEN B

Method for transmitting a transmission layer from a substrate, such as graphene layer, to a carrier substrate, such as glass substrate and ceramic substrate, involves transmitting a graphene layer from substrate to carrier substrate.

MOKKAPATI V R, POVAZAY B, UHRMANN T, ULLMANN T, MOKKAPATI V R S S, SARMA M V R, THOMAS A

Method for manufacturing thermal conductive plate, involves attaching good thermal conductor containing hydrophilic graphene to surface of reinforcing portion and/or shell to form film-like hydrophilicity adhesion layer.

WU C M

Using deposition system involves loading wafer into processing chamber equipped with RF system, supplying aromatic hydrocarbon precursor into processing chamber, turning on RF power of RF system to decompose aromatic hydrocarbon precursor into active radicals.

WU C, NI I, HSU Y, HUANG J, XU Y, WU Z

Depositing graphene on a metal surface of substrate by providing substrate including metal surface in reaction chamber, flowing hydrocarbon precursors into reaction chamber and toward the substrate, and generating radicals of hydrogen.

VARADARAJAN B N, NARKEVICIUTE I

Producing polymer-coated graphene layer structure involves e.g. adding substrate to reaction chamber, supplying flow comprising precursor compound to form graphene layer structure, heating and spin-coating using polymer or polymer precursor.

GLASS H, GUINEY I, TYLER M, WALLIS R, THOMAS S, TAYLOR M

Production of electronic device such as integrated circuit board, involves providing substrate, supplying flow comprising precursor compound, selectively laser ablating graphene, and selectively laser ablating surface of substrate.

GLASS H, GUINEY I, TYLER M, WALLIS R, BAINES R, THOMAS S