国家/地区 世界知识产权组织（7）
IPC部 C（7）
IPC大类 C23（7）
IPC小类 C23C（7） C01B（5） B82Y（3）
H01L（3） H05K（3） B32B（2）
B41M（2） G03F（2） G06F（2）
IPC B82Y040/00（3） B32B015/04（2） B41M001/26（2）
B82Y030/00（2） C01B032/184（2） C01B032/186（2）
C23C014/06（2） C23C016/04（2） H05K003/12（2）
发明人 NAVEH D（2）
公开年 2022（7）
申请年 2022（4）  2021（2） 
专利权人 UNIV BARILAN（2）

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Repairing layers of laminate stack or printed circuit board, comprises providing layered structure, identifying fault location in outer graphene layer, preparing surface of outer graphene layer, and applying localized heat on fault location.

MENTOVICH E, ATIAS B, NAVEH D, LEVI A, SMOLINSKY E Z B

Transferring molecular material to surface involves contacting substrate with solution-synthesized polymer precursors, removing bulk pyrene matrix, and surface-assisted cyclodehydrogenation.

CROMMIE M F, FISCHER F R, BOKOR J, JACOBSE P H, MUTLU Z, MCCURDY R D, VEBER G C, RIZZO D J

Forming graphene layer structure, comprises providing growth substrate having growth surface, and forming graphene layer on growth surface by chemical vapor deposition, where growth surface is formed of material e.g. yttrium-stabilized zirconia.

DIXON S, GUINEY I, THOMAS S, GRIFFIN R M, BADCOCK T J

Laminate used for electronic device such as display device, comprises substrate, layer containing compound having condensed polycyclic hydrocarbon structure, and layer containing conductive material.

NAOYA N, KAZUNORI T, NOSAKA N, TAKANASHI K

Patterning method for manufacturing of a desired pattern of an electrically conducting, semiconducting or insulating material on a substrate,.

LEPPAENIEMI J, SNECK A

Anti-corrosive metal housing for electronic device has metal substrate, passivation layer including oxyanion e.g. molybdate, vanadate, and/or manganese salt, and sealing layer including e.g. sodium silicate, zinc powder, and/or clay powder.

LI Y, CHUANG Y C, WU K