国家/地区 中国（12） 日本（6） 美国（6） 韩国（3） 台湾（2） 世界知识产权组织（2）
IPC部 C（21）
IPC大类 C25（21）
IPC小类 C25D（21）
IPC C25D007/00（21）
发明人 GO M（2） WU S Z（2）
公开年 2021（10） 2022（6） 2023（4）
申请年 2021（10）  2022（5）  2020（3）  2019（2） 
专利权人 NAGOYA INST .（4）

Coating solution useful for hole metallization of printed circuit board, comprises edge modified graphene, high molecular polymer, condensing agent, surface energy auxiliary agent, super dispersant, water and pH regulator comprising aqueous ammonia or sodium carbonate solution.

JING W, LI B, LI R, LI F, WU Q, PAN G

Graphene/metal composite layer structure useful in item in electroplating process, preferably used for flexible circuit board, comprises interpenetrating network formed by interlocking electroplated metal and graphene surfaces.

YE G, CAO X, ZHANG J, ZHENG K, LU J, MA Y

Tin-graphene composite plating film used for vehicle-mounted terminal and electronic component, comprises tin-graphene composite plated film portion provided with base material for electric connection or electricity supply, and base material.

GO M

Discoloration-resistant silver plating structure used for contact terminal, comprises silver plating layer, and coating layer comprising resin, carbon fibers, titanium alkoxide, and conductive filler such as carbon, carbon nanotubes, graphene, and/or graphite.

SEAL P S, PYO H S

Silver-graphene composite plating film metal-made portion used for automotive terminal, comprises substrate coated with plated film containing silver, and graphene and having specific Vickers hardness and abrasion coefficient.

GO M

Conductive pre-coating useful for e.g. fuel cell titanium plate, comprises first metal particle layer distributed on surface of titanium substrate, in-situ oxidation layer covering surface of first metal particle layer, and second metal layer covering surface of in-situ oxidation layer.

LAN S, HU P, JIANG T, BI F, LI H

Optimized filling holes comprise modifying insulative inner wall of blind hole with reduced graphene oxide, depositing copper in blind hole through electroplating process, removing first dry film to expose copper foil, and removing exposed copper foil.

YANG N, YEH A

Preparing negative charge oxidation graphene, comprises adding concentrated sulfuric acid in reaction container, adding graphite powder, persulfate and phosphorus oxide, and adding concentrated sulfuric acid into graphite solution.

SONG T, CHEN W, PAN Z, LIU Z

Preparing highly conductive and corrosion-resistant polymer complex coating useful in fuel cell vehicles comprises depositing graphene oxide coating on surface of metal substrate, and depositing a polyaniline/carbon nano-tubes complex coating on surface of graphene oxide coating.

ZHOU M, TAN X, LU Q, WANG N, ZHENG N, FENG S, XIA D, YANG G, ZHAO C, YANG H, CUI C, XU L

Plating of metal bipolar plate includes mixing modified synthetic resin with high conductivity material to obtain coating slurry and applying coating slurry on metal bipolar plate.

YE H