国家/地区 |
中国(11)![]() |
IPC部 |
B(11)
C(7)
H(3)
A(2) G(2) |
IPC大类 |
B01(11)![]() |
IPC小类 |
B01D(11)![]() |
IPC |
B01D067/00(11)![]() |
发明人 |
CHOI K(2)
HEIGHT M(2)
PARK H(2)
PARK H G(2) |
公开年 | 2017(3) 2021(3) 2015(2) |
申请年 | 2016(2) 2021(2) |
专利权人 | HEIQ MATERIA.(2) |
JU Y, YI J, WANG W, WANG D
WANG L, ZHANG X, HAN Y, REN G, SUN L, YAN R, MENG D, LIU Z
CHOI K, PARK H G, HEIGHT M, CHOI K J, PARK H, PIAO H
PARK H G, HEIGHT M, CHOI K, PARK H
ZHENG S, KITAHARA I, SIDDIQUI O, YAMASHIRO Y, LIN W, ERICSON J, ROMERO R, WANG P, NOUMI S, BARTELS C R, HSIEH W, HIROSE M, KOBUKE M, ERICKSON J, OOU M
LAI Y L, CHANG C C, YAN S Y, HSU J N, KUO C N, YEN S I, LAI Y, ZHANG Z, YAN S, XU R, GUO J
RAVEENDRANNAIR R, SU Y, GEIM A, RAVEENDRAN N R
LIU W, HUNG W, LAI J, LEE K, HONG W, LI K, LIU W J, HUNG W S, LAI J Y, LEE K R