国家/地区 中国（37）
IPC部 B（37）
IPC大类 B32（37） C08（23） C09（9）
C04（4） H05（4） C23（3）
B29（2） D06（2） E04（2）
IPC小类 B32B（37）
IPC B32B017/02（37）
发明人 WANG Q（3） WANG X（3） XU Y（3）
ZHANG J（3） CHEN K（2） HUANG Y（2）
LI Y（2） LIU W（2） LIU X（2）
WANG L（2） WU B（2） WU H（2）
YU D（2） ZHANG M（2） ZHANG Y（2）
公开年 2021（11） 2022（10） 2018（6） 2023（4） 2020（3）
申请年 2020（13）  2022（9）  2021（6）  2018（5）  2017（2） 
专利权人 ITEQ WUXI EL.（2） JIANGSU YAO .（2）

Preparing polyphenylene oxide resin-based copper clad laminate comprises taking glass fiber cloth and impregnating a glue solution, drying to obtain prepreg, taking 5-10 sheets of prepregs, laminating them, and covering piece of copper foil on both sides of laminated prepregs.

XIE J, WANG X, WU H

Satellite surface wave-absorbing skin structure for satellite, has thermal control layer bonded to upper surface of wave-transmitting enhancement layer, wave-absorbing honeycomb layer, and reinforced shielding layer for isolating electromagnetic wave penetration on both sides of absorbing skin.

FU X, MI X, ZHANG H, WANG X, GAO W, XU Y

Thermal insulation and sound-absorbing silica aerogel composite material for heat preservation, is composed of base material layer and aerogel fireproof slurry layer arranged on surface of base material layer, where base material layer is silica aerogel felt prepared by spraying process.

HE L, ZHAI S, CHANG A, YANG J, LIU X

Stretch-resistant graphene aerogel thermal insulation material as heat-insulating material, heat reflecting material, vacuum material, comprises graphene oxide aerogel layer, graphene oxide-ethanol adhesive layer, modified glass fiber layer, where graphene oxide-ethanol adhesive layer is two layers.

HUANG Z, ZHOU Z, ZHU Q, ZHENG Z

Epoxy resin fiber cloth used in laminated board, is prepared by impregnating or coating glass fiber cloth and epoxy resin adhesive prepared from epoxy resin and curing agent comprising dicyandiamide and modified phenolic resin.

GAO Z

Processing high-strength computer back cover with middle frame, involves cutting epoxy glass fiber board to obtain middle frame board and cover board, milling mounting cavity on middle frame plate to form middle frame and then middle frame and cover plate are welded to obtain computer rear cover.

CAI C, YU F, LU M, CHEN J, HE H

Backboard useful in fields of mobile phone backboard, comprises silicone layer, reinforcement layer and polycarbonate layer arranged in sequence from top to bottom, which has ultra-thin thickness, high strength and stain proof.

LIU W, GAN X, XU X, TAO Y

Epoxy resin-based copper-clad plate filled with alumina used for e.g. electric device insulation has electronic glass fiber cloth, dipping material and copper foil, where electronic glass fiber cloth is soaked in dipping material and processed into prepreg and copper foil set on two sides of prepreg.

WU H, CHEN Y

Low-expansion coefficient halogen-free resin composition useful in laminate for printed circuit board, comprises e.g. o-cresol formaldehyde epoxy resin, bismaleimide resin, cyanate ester hardener and bisphenol A type 9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide hardener.

CHEN K, YU D

Low-expansion coefficient halogen-free resin composition useful in laminate and printed circuit board, comprises e.g. o-cresol epoxy resin, bis(4-maleimidophenyl)methane, polyvalent hydroxy-modified styrene resin, phosphinate and cyanate ester hardener.

CHEN K, YU D