国家/地区 世界知识产权组织（6） 美国（4） 德国（3）
IPC部 C（6）
IPC大类 C01（6）
IPC小类 C01B（6）
IPC C01B032/182（5） C01B032/184（3） C23C014/06（3）
H05K003/46（3） B32B007/12（2） B32B009/00（2）
B32B015/04（2） B32B037/12（2） H05K001/02（2）
H05K001/03（2）
发明人 NAVEH D（4） ATIAS B（3） LEVI A（3）
MENTOVICH E（3） BENNAIM Y（2） DANINO S（2）
ELIYA Y（2） LIPP E（2） NAVEH D Y（2）
ROTEM Y（2）
公开年 2022（4） 2023（2）
申请年 2022（6）
专利权人 UNIV BARILAN（6）

Coating metal surface with graphene used in organic LED by depositing first graphene molecular precursor on top of metal surface and transforming deposited first graphene molecular precursor into surface bound graphene interfacial layer.

NAVEH D Y

Method for coating non-metallic surface for semiconductor device, involves obtaining graphene molecular precursor comprising substituted hydrocarbyl compound, depositing precursor on non-metal surface, reacting to form covalent bonds, and transforming deposited precursor into surface.

NAVEH D Y

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Repairing layers of laminate stack or printed circuit board, comprises providing layered structure, identifying fault location in outer graphene layer, preparing surface of outer graphene layer, and applying localized heat on fault location.

MENTOVICH E, ATIAS B, NAVEH D, LEVI A, SMOLINSKY E Z B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A