国家/地区 中国（24） 世界知识产权组织（22） 美国（20） 台湾（14） 韩国（12） 日本（11） 德国（5） 欧洲专利局（EPO）（2） 英国（2） 印度（2） 菲律宾（2）
IPC部 C（65）
IPC大类 C01（65） H01（58） H05（10）
B82（9） C23（5） C30（4）
C07（3） C08（3） G01（3）
G02（3） H04（3） B32（2）
C09（2）
IPC小类 C01B（65）
IPC C01B032/182（65）
发明人 LI Z（5） LI S（4） WU J（4）
XIAO D（4） ATIAS B（3） LEVI A（3）
MENTOVICH E（3） NAVEH D（3） BADCOCK T J（2）
BENNAIM Y（2） BIANZON P N P（2） CO F D C（2）
DANINO S（2） DIXON S（2） ELIYA Y（2）
公开年 2022（65）
申请年 2021（39）  2022（16）  2020（10） 
专利权人 TAIWAN SEMIC.（5） FUJITSU LTD（4） GUANGZHOU ZH.（4） MELLANOX TEC.（3）
UNIV BARILAN（3） CTRON ADVANC.（2） NARA INST SC.（2） PARAGRAF LTD（2）
PCB TECHNOLO.（2） PHILIPPINE S.（2） SAMSUNG ELEC.（2） SEMICONDUCTO.（2）
UNIV CALIFOR.（2） UNIV TSINGHU.（2）

Transistor for semiconductor device, has channel layer that comprises graphene layer and hexagonal boron nitride sheets dispersed in graphene layer and arrangement directions of hexagonal boron nitride sheets that are aligned and source/drain region next to gate stack that is obtained.

CHEN Z, CHU Z, CHEN T, CHUU C

Method for maintaining temperature adaptability by terminal, involves analyzing temperature information of collected screen, and controlling heating device to heat according to analysis result and conducting heat to screen through graphene radiating material layer and eccentric heat pipe shaft.

QI Y, SUN Y, QIN X

Forming lamination stack by providing core, applying adhesive layer to top surface of core, and attaching graphene-metal structure to top surface of core via adhesive layer, where graphene-metal structure comprises metal layer and graphene layer on top surface of metal layer or bottom surface.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B

Repairing layers of laminate stack or printed circuit board, comprises providing layered structure, identifying fault location in outer graphene layer, preparing surface of outer graphene layer, and applying localized heat on fault location.

MENTOVICH E, ATIAS B, NAVEH D, LEVI A, SMOLINSKY E Z B

Creating conductive-lubricant-coated printed circuit board (PCB) by providing lamination stack, and applying heat and pressure to lamination stack to form PCB, where process to create lamination stack comprises attaching conductive-lubricant-metal structure to core through adhesive layer.

NAVEH D, LEVI A, BENNAIM Y, ELIYA Y, DANINO S, LIPP E, MENTOVICH E, ROTEM Y, ATIAS B, RUBINSTEIN A, RUBINSTEN A

Heat dissipation structure for electronic device e.g. mobile phone, has heat dissipation module whose side protrudes from top surface of heat generating element, and does not contact with surface of carrier.

HE M, HUANG H, HUANG C

Graphene flake for regulating zero-point potential energy, has multi-component material surface charge modulation layer that is combined on surface of target object to modulate mesopotential of target surface.

CHANG C, TSENG I, SU Y

Graphene element used as field effect transistor having top gate structure, comprises boron nitride layer having turbostratic structure, and graphene layer in contact with boron nitride layer.

KONDO O

Producing phythalocyanine-graphene hybrid material in one step comprises e.g. preparing electrolyte solution comprising phthalocyanine compound desired to be obtained simultaneously on surface of graphite working electrode.

SAHIN Y, GUERSU H, KOYUN O, GOERDUEK S

Method for producing graphene electrode with cell structure used in lithium-ion battery involves using plasma sintering technology to solve problem of difficult fusion between graphene sheet, and using nano metal particles to cut and tunnel graphene under plasma atmosphere.

SUN B