国家/地区 世界知识产权组织（25）
IPC部 B（25）
IPC大类 B32（25）
IPC小类 B32B（25）
IPC C01B031/02（17） B32B009/00（13） C01B031/04（13）
C23C016/26（9） B82Y030/00（7） B82Y040/00（7）
B32B027/06（5） B32B038/10（5） B32B027/00（4）
B82B003/00（4） C01B032/186（4） H01B013/00（4）
B32B009/04（3） C01B032/182（3） H01L021/02（3）
发明人 CHOI J（2） CHOI J O（2） HASEGAWA S（2）
HASEGAWA SHOJI（2） KIM H K（2） KWON O K（2）
LEE Y（2） MARTENS R I（2） MILLER S（2）
MILLER S A（2） YANG W S（2）
公开年 2013（25）
申请年 2012（15）  2013（7）  2011（3） 
专利权人 GRAPHENE PLA.（4） UNIV SUNGKYU.（3） EMPIRE TECHN.（2） KOREA ELECTR.（2）
LMS CO LTD（2） TE CONNECTIV.（2） TYCO ELECTRO.（2） UNIV SUNGKYU.（2）

Graphene laminate for e.g. transparent electrode, has at least one layer graphene film in which carbon atom is covalently bonded, adhesion layer having physical adhesive force, and base material provided with predetermined strength.

HASEGAWA SHOJI

Production of graphene laminate used for e.g. transparent electrode, involves bonding adhesive layer provided on one surface of base to graphene film-side surface of another base provided with graphene film, and peeling another base.

HASEGAWA S

Manufacture of molding component involves adhering graphene laminate including base having predetermined strength and layer(s) of graphene film in which carbon atoms are covalently bonded to component when component is molded.

HASEGAWA S

Graphene laminated material used for e.g. transparent electrode, comprises graphene film containing covalently bonded carbon atoms, adhesive layer having physical adhesiveness and base material having predetermined strength.

HASEGAWA SHOJI

Transparent conducting film comprises graphene of specified thickness, visible transmittance and surface resistance.

LI G, WANG Y, LEE K

Manufacturing laminated structure used in e.g. display, comprises bonding layer of graphene film on first substrate to second substrate with adhesive resin layer, removing first substrate and forming transparent layer on graphene film.

KIMURA N, SHIMIZU K, FUKUDA T

Manufacturing electrical conductor used in e.g. cables and printed circuit boards involves providing base substrate; providing foil; depositing graphene layer on foil to define layered structure; and depositing structure on base substrate.

MARTENS R I

Preparing multilayer article from semiconductor substrate involves forming metal film on front of substrate; forming layer of boron nitride; and forming layer of graphene between substrate and the back metal film surface.

SEACRIST M R, BERRY V, NGUYEN P T

Manufacturing electrical conductor, comprises providing substrate layer, depositing surface layer on substrate layer, and depositing graphene layer on substrate layer.

SULLIVAN M M E, HILTY R D, MARTENS R I, ZHENG M, HEMOND J H B, LIU Z, SULLIVAN MALERVY M E, SULLIVAN MALERVY M, HILTY R, MARTENS R, HEMOND J, SULLIVANMALERVY M E

Barrier article for rendering substrate impermeable to small molecules, and for sealing openings on substrate, comprises a substrate and a continuous graphene-based layer adhered to the surface of the substrate.

HURT R H