国家/地区 中国（4） 韩国（4） 世界知识产权组织（2）
IPC部 C（7）
IPC大类 C04（7）
IPC小类 C04B（7）
IPC C04B038/00（7）
发明人 HO M J（2） SEUNGGYEONG Y（2）
公开年 2022（5） 2021（2）
申请年 2021（7）
专利权人 SBB CO LTD（2）

Producing heat dissipation material, comprises preparing porous carbon material by calcining carbon material, preparing alkylated ceramic filler by reacting ceramic material with alkyl alcohol, and filling pore with alkylated ceramic filler.

HOUN K J

Preparing aerogel with double-oriented network used as heat-conducting composite material comprises mixing filler, polymer agglomerant and water, placing double-orientation molding device in refrigeration medium, adding filler mixture, freezing, freeze-drying, sintering and heat-treating.

XU J, ZENG X, SUN R, YAO Y

Water-permeable block comprises e.g. porous structure having honeycomb structure and filler to be filled in empty space of porous structure, includes gravel and bio-urethane-based adhesive containing polymeric methylenediphenyl diisocyanate.

HO M J, SEUNGGYEONG Y

Water-permeable block comprises e.g. gravel and bio-urethane-based adhesive containing first agent comprising polymeric methylenediphenyl diisocyanate and isocyanate monomer and second agent comprising petroleum polyether polyol.

HO M J, SEUNGGYEONG Y

Preparing a porous material comprises e.g. preparing a solution to be frozen, patterning the surface of the cold source to obtain the surface of the cold source with a micro structure, pouring a solution to be frozen into a freezing mold and performing directional freezing.

GAO W, WANG M, ZHAO N, LI M, BAI H

Hollow particles used for heat-dissipation fluid composition, comprise inorganic particle layer comprising ceramic particles and conductive carbon-based particles as spherical hollow particles and having empty inner space inside, and polymer coating layer.

KWON K A, CHUN M S, KIM D Y, SEOK C M, KIM D, QUAN W, QUAN J

Use of silicon carbide whisker modified with fluorosilane coupling agent oligomer, for improving thermal conductivity of silicon carbide ceramic plate used for substrates of high-brightness LED light source.

ZHANG X, LING J, PAN T, BAI W