国家/地区 中国（21）
IPC部 C（21）
IPC大类 C08（21）
IPC小类 C08G（21）
IPC C08K003/38（21）
发明人 WEN Y（7） WANG X（5） WANG L（4）
CHENG X（3） XU G（2）
公开年 2018（9） 2021（4） 2022（3） 2017（2） 2020（2）
申请年 2016（10）  2020（4）  2022（3）  2017（2） 
专利权人 HENAN HAINAD.（7）

Addition-type organic silicon heat-conducting adhesive masterbatch comprises organic silicon monomer I, organic silicon monomer II, blocking agent, catalyst I and high heat-conducting filler.

HAN Y

Flexible heat dissipation material comprises polymer masterbatch modified by hydroxylated boron nitride nanosheets; functionalized graphene; and polymer.

LI X, HE Y, GUO H

High heat-conducting insulating radiating fin useful for energy battery in mobile phone, flat computer and layer of heat-conducting radiating film, comprises thermally conductive layer and a thermally conductive insulating layer connected to the thermally conductive layer.

ZHOU Z, ZHU Q, ZHENG Z

Preparation of polyimide composite molded plastic used for e.g. electronic appliances, involves hot-molding thermally conductive polyimide composite powder material, mixing with solvent, aromatic diamine and aromatic dibasic acid anhydride, and heat-molding powdery polyimide composite molding powder.

XU G, XUE F, ZHOU J

High heat-conducting four-needle-shaped composite particle/polyimide film useful in electronic materials e.g. thermal management materials and interface materials, comprises heat-conducting filler, surfactant and polyamic acid solution.

MA C, CHI H, LIU D, ZHANG P, DAI P

Preparing flame-retardant epoxy resin composite material with simultaneous microwave peeling and intercalation of organically modified nano two-dimensional materials comprises mixing two-dimensional material and deionized water.

WU Z, DU J, GUO J, FAN Q

Heat-resistant composite dielectric material comprises epoxy resin as substrate, and benzoxazine additive curing, and boron nitride nano sheet and fluorinated graphene as filler, by stripping hexagonal boron nitride into nano-sheet.

REN J, QIU Y, QING Q, BAO P, XU G

Preparing boron nitride-graphene-polyimide wave heat-absorbing waveguide material, comprises e.g. ball milling boron nitride powder and graphene powder, adding stirring diamine and dianhydride, drying, tableting, heating and curing.

HAN X, YANG C, YANG H, LI M, GUO W, SHEN F

Thermally conductive boron nitride-modified polyurea insulating complex material comprises e.g. boron nitride-graphene oxide complex materials, silane coupling agent, polyetheramine, dibutyl maleate, and dimethylthiotoluenediamine,.

LUO G

Functionalized graphene used in polyorganosiloxane, comprises one or more active molecules and graphene, and multiple active molecules are isolated from each other, where each of active molecules is grafted onto graphene.

XU Y, LIN Y, HODGE S, FERRARI A