国家/地区 中国（12） 美国（2）
IPC部 C（13） B（2）
IPC大类 C08（13） C09（4） B32（2）
IPC小类 C08G（13）
IPC C08K003/38（13）
发明人 LIU S（2） MA Y（2） XU G（2）
YUAN Y（2） ZHAO J（2）
公开年 2021（13）
申请年 2020（9）  2021（4） 
专利权人 UNIV SOUTH C.（2）

Bio-based nano-synergistic flame retardant used in polymer composite material e.g. epoxy resin composite material, comprises two-dimensional material, transition metal organic framework intercalated in material, and phytic acid wrapped outside organic framework.

GONG K, ZHOU K, YIN L

Preparing furan resin comprises e.g. adding solid formaldehyde and urea into reaction kettle, adding boric acid, carrying out catalytic reaction of prepared graphene dispersant and furanone, carrying out, adjusting pH, reacting with modified lignin and stirring with coupling agent and metal salt.

ZHENG J, HOU X, LUO X, SUN D, LIU M, PAN Y, SUN Z

Preparation of polyimide composite molded plastic used for e.g. electronic appliances, involves hot-molding thermally conductive polyimide composite powder material, mixing with solvent, aromatic diamine and aromatic dibasic acid anhydride, and heat-molding powdery polyimide composite molding powder.

XU G, XUE F, ZHOU J

Polymeric material for two-portion composition, comprises a polymerized reaction product of a polymerizable composition comprising components, where components comprises a uretdione-containing material.

WHITE K L, YAO L, RULE J D, KRYGER M J, KROPP M A

Preparing heat dissipation film based on large-diameter graphene oxide comprises e.g. stirring modified graphene oxide, modified boron nitride, modified carbon nanotube and solvent into reactor, reacting and casting polycondensate into film.

CUI J, XU P, LI Y, ZHANG B

High heat-conducting four-needle-shaped composite particle/polyimide film useful in electronic materials e.g. thermal management materials and interface materials, comprises heat-conducting filler, surfactant and polyamic acid solution.

MA C, CHI H, LIU D, ZHANG P, DAI P

Preparation of discontinuous fiber-reinforced polyhexahydrotriazine resin-based thermally-conductive composite material involves prepolymerizing formaldehyde and aromatic amine, mixing with discontinuous fibers to obtain prepreg, and curing.

YUAN Y, MA Y, ZHAO J, LIU S

Preparing flame-retardant epoxy resin composite material with simultaneous microwave peeling and intercalation of organically modified nano two-dimensional materials comprises mixing two-dimensional material and deionized water.

WU Z, DU J, GUO J, FAN Q

Preparing continuous fiber reinforced polyhexahydrotriazine resin-based thermally conductive composite material e.g. comprises dissolving formaldehyde and aromatic amine in water/non-proton solvent mixed solution and then pre-polymerizing.

YUAN Y, MA Y, ZHAO J, LIU S

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J