国家/地区 中国（14）
IPC部 C（14） H（2）
IPC大类 C08（14） C09（4）
IPC小类 C08G（14）
IPC C08L079/08（14）
发明人 LIAO B（3） QIAN X（3） ZHANG B（3）
LIU H（2）
公开年 2021（7） 2020（4） 2022（3）
申请年 2020（14）
专利权人 ZHUZHOU TIME.（3）

Manufacture of high heat-resistant ultra-low expansion polyimide film for e.g. electronics, microelectronics , optical display or optical communication field, by mixing raw material with solvent, filtering, vacuum defoaming, uniformly coating, and peeling substrate.

QIAN X, LIAO B, ZHANG B

Preparing high temperature resistant polyimide useful for manufacturing flexible display substrate, comprises e.g. carrying out suction filtration and vacuum defoaming of polyamic acid resin solution, casting on casting plate, solidifying into adhesive film.

QIAN X, LIAO B, ZHANG B

New low-dielectric polyimide useful in preparation of low-dielectric polyimide film for electronic packaging.

QIAN X, LIAO B, ZHANG B

Preparation of polyimide composite molded plastic used for e.g. electronic appliances, involves hot-molding thermally conductive polyimide composite powder material, mixing with solvent, aromatic diamine and aromatic dibasic acid anhydride, and heat-molding powdery polyimide composite molding powder.

XU G, XUE F, ZHOU J

Composition for forming composite material, comprises polyaryletherketone copolymer comprising polyetheretherketone containing structural unit and poly(ether diphenyl ether ketone) containing structural unit, and poly(etherimide).

RICH J, ELHIBRI M J, LEACH J, ELHIBRI M

Aqueous anti-corrosion non-stick coating comprises fluorine resin emulsion, polyamide-imide (PAI) emulsion, anti-corrosion filler, pigment, auxiliary agent, pH regulator and water.

LIU H, QIAN T

Preparing functionalized cross-linked polyimide aerogel heat insulation material useful in high-end thermal insulation materials and other fields comprises adding cross-linking agent into container, adding nitric acid and stirring.

CUI S, SONG Z, WANG X, ZHAO Y, HUANG L, LIU W, YUAN M

High dielectric polyimide film comprises polyimide and graphene oxide uniformly filled in the polyimide.

XU J

Maleimide resin film used in maleimide resin composition and as adhesive resin film having low dielectric property, comprises maleimide, (meth)acrylate, inorganic particles with respect to whole resin film and curing catalyst.

IGUCHI H, TSUTSUMI Y, KASHIWAGI T, DI J

Hot melt prepreg processing borosilicate phenolic resin comprises phenol, aldehyde, boron-containing compound, silicate, modifier and toughening agent, modifier, and toughening agent.

YAO Y, WEI X, LIU J, WANG L, LIU H, TIAN M