国家/地区 中国（18） 美国（2） 世界知识产权组织（2）
IPC部 C（19）
IPC大类 C08（19）
IPC小类 C08G（19）
IPC C08G073/10（19）
发明人 CHEN C（2） HUANG T（2） WANG D（2）
YANG L（2） ZHAO J（2） ZHAO X（2）
ZHENG Z（2） ZHOU H（2） ZHOU Z（2）
ZHU Q（2）
公开年 2020（4） 2017（3） 2021（3） 2023（3）
申请年 2020（4）  2011（2）  2016（2）  2019（2）  2021（2）  2022（2）  2023（2） 
专利权人 DONGGUAN HON.（2） UNIV JILIN（2）

Preparing three dimensional thermally conductive skeleton/polyimide thermally conductive composite material comprises subjecting thermally-conducting porous material soaked by polyamic acid solution, performing freeze drying and phase conversion treatment to thermally-conducting porous material.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing thermally conductive filler/polyimide aerogel metallized high thermally conductive composite material, involves preparing thermally conductive filler/polyimide aerogel, electroplating aerogel material, and vacuum hot pressing.

CHEN C, ZHAO X, ZHOU H, ZHAO J, YANG L, WANG D

Preparing phase change graphene composite material useful as battery pack radiating material, comprises e.g. adding titanate coupling agent and aqueous ammonia, dissolving pyromellitic dianhydride and 4,4'-diaminodiphenyl ether in solvent, and polymerizing modified graphene oxide and isoquinoline.

HUANG Z, ZHOU Z, ZHU Q, ZHENG Z

High heat-conducting insulating radiating fin useful for energy battery in mobile phone, flat computer and layer of heat-conducting radiating film, comprises thermally conductive layer and a thermally conductive insulating layer connected to the thermally conductive layer.

ZHOU Z, ZHU Q, ZHENG Z

Preparing polyimide/graphene composite thermally conductive film, involves performing polycondensation of dianhydride, crosslinking polyamic acid and polyvinyl alcohol followed by subjecting film-forming mixture to thermal imidization.

XU Z, LIU G, ZHANG Q

Preparation of polyimide composite molded plastic used for e.g. electronic appliances, involves hot-molding thermally conductive polyimide composite powder material, mixing with solvent, aromatic diamine and aromatic dibasic acid anhydride, and heat-molding powdery polyimide composite molding powder.

XU G, XUE F, ZHOU J

High heat-conducting four-needle-shaped composite particle/polyimide film useful in electronic materials e.g. thermal management materials and interface materials, comprises heat-conducting filler, surfactant and polyamic acid solution.

MA C, CHI H, LIU D, ZHANG P, DAI P

Preparing three-dimensional graphene hollow sphere modified polyimide material, comprises e.g. adding graphene oxide solution into spherical silicon dioxide sol, ultrasonically dispersing, freezing and drying.

LIU Y, HU M, LV X, GU W, QIU Y

High thermal conductivity graphene modified polyimide porous material comprises diamine functionalized graphene, 3,5-diaminobenzoic acid, dianhydride monomer, acetic anhydride and pyridine.

MEI H

Preparing boron nitride-graphene-polyimide wave heat-absorbing waveguide material, comprises e.g. ball milling boron nitride powder and graphene powder, adding stirring diamine and dianhydride, drying, tableting, heating and curing.

HAN X, YANG C, YANG H, LI M, GUO W, SHEN F