国家/地区 中国（71）
IPC部 C（71）
IPC大类 C08（71）
IPC小类 C08L（71）
IPC C08K003/04（52） H05K009/00（41） C08J005/18（24）
C08K003/22（17） C08K007/06（13） C08K003/08（11）
H05B003/14（11） C08L063/00（9） C08L075/04（9）
H05K007/20（9） C08L023/12（8） C08L083/04（8）
C09K005/14（8） C08K009/02（7） C08K003/36（6）
发明人 WANG Z（6） LI Y（5） WANG Y（5）
ZHANG Y（5） LI X（3） LIU C（3）
PAN Z（3） ZHANG J（3） ZHOU J（3）
BAI H（2） CHEN C（2） CHEN Y（2）
DAI M（2） GUO J（2） HE J（2）
公开年 2022（48） 2023（23）
申请年 2022（71）
专利权人 UNIV SOUTH C.（3） UNIV ZHEJIAN.（3） ANHUI AEROSP.（2） CHANGSHU SHE.（2）
REBORN BIOTE.（2） SHENGYI TECH.（2） UNIV SHANGHA.（2） UNIV SICHUAN（2）
UNIV ZHONGSH.（2）

Heat dissipation film has two-dimensional heat conduction elements assembled in orientation, and is prepared by dispersing two-dimensional heat conduction elements and gel components in water, placing planar substrate that can release charged particles in assembly liquid, and assembling element.

GAO W, ZHAO N, WU Y, BAI H

Resin composition used for preparing low-flow glue prepreg for rigid-flexible combined printed circuit board, comprises epoxy resin, epoxy curing agent, curing accelerator, carboxy-terminated nitrile rubber, and oxazoline compound.

ZHANG W, CHEN C, HE J

Preparing integrated porous electrothermal anti-icing material involves immersing end of porous polydimethylsiloxane material in conductive silver paste, placing copper foil on both sides of material, coating graphene conductive liquid, drying and solidifying.

LEI X, ZHANG Y, GU J, YU J, GU X, QI H

Resin composition useful in preparing low-flow adhesive prepreg comprises epoxy resin, epoxy curing agent, curing accelerator, carboxylated nitrile rubber, carbodiimide compound.

ZHANG W, CHEN C, HE J

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Foamed wave-absorbing material comprises polypropylene, wave absorbing agent, metal micro-nano particles, flame retardant, compatibilizer, stabilizer, antioxidant and lubricant.

LI H, NIE J

Low-temperature-resistant and high-modulus electromagnetic shielding material useful in field of functional polymer materials, comprises e.g. polycarbonate e.g. bisphenol A polycarbonate resin, toughening agent e.g. silicone core-shell polymer, and carbon-based conductive filler e.g. graphene.

WU T, LI Y

Microporous foam material useful in wave-absorbing material, energy storage material and sensor field, comprises thermoplastic resin, modified graphene plasticizer, lubricant and antioxidant.

HE X, LIU Y, ZHOU J, CHEN P, TAN R, JIANG T

Preparing high electromagnetic shielding nanofiber gas gel having gradient structure, comprises e.g. mixing isopropanol, deionized water and poly(vinyl alcohol-co-ethylene) nanofiber, adding graphene oxide, silver nanowires into poly(vinyl alcohol-co-ethylene) nanofiber suspension, and freeze-drying.

WANG W, YAN K, WEN X, YANG C, WANG D

Preparation of composite heat-conducting film for preparing heat dissipation component of electronic device, involves adding carbon nanotube dispersion to aramid nanofiber aqueous dispersion to form modified dispersion liquid, compounding with graphene dispersion, filtering, drying and heat-treating.

ZHANG D, DIAO R, WANG Y