国家/地区 中国（9） 世界知识产权组织（3） 日本（2） 美国（2）
IPC部 C（9）
IPC大类 C08（9）
IPC小类 C08K（9）
IPC C09K005/14（9）
发明人 LIN Y（2）
公开年 2021（9）
申请年 2020（5）  2019（2）  2021（2） 
专利权人

Preparation of heat conducting gasket used for electronic products by mixing phase change material, heat conducting filler, matrix material and crosslinking agent, performing curing crosslinking reaction, and freezing preform.

CHU W, JIANG N, LI M, YU J

Thermally conductive gasket comprises thermally conductive filler, which is two-dimensional thermally conductive filler arranged along thickness direction of gasket..

GE X, LI F, LI Z, SHI Y, ZHOU B

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Flexible heat-conducting insulating material used in electronic device, and preparing heat-dissipating plate and smart power module, comprises silicone oil, metal oxide and curing agent, where curing agent is hydrogen-contained silicone oil.

WANG X, FENG Y

Elastic heat spreader film used for forming structural component, comprises graphitic film comprising graphitic crystals, and having preset thermal conductivity, electroconductivity and physical density, and elastomer or rubber.

LIN Y, JANG B Z, ZHANG B, JEAN B

Preparing bending-resistant composite radiating film comprises e.g. taking graphite oxide aqueous solution, firstly adding radiating filler, stirring uniformly, then adding emulsifier and stirring until emulsifier is completely dissolved.

LIN Y, LI X, ZHANG Y, YANG X

Preparing heat-conducting and wave-absorbing integrated graphene thermal interface material comprises taking graphene oxide as carrier, compounding heat-conducting insulating material and magnetic insulating material.

YAO L, LIU Y, LIU M, ZHENG J

Preparation of graphene reinforced thermal conductive composite film for electronic product, involves punching graphene film to form graphene film with closed bubble structure, coating fluidity-adjusted polymer on graphene film and curing.

WANG N

Silica gel composite material comprises magnetic and heat-conducting wave-absorbing material formed by oriented arrangement of magnetic boron nitride nanosheets, thermally conductive powder, and MXene nanosheets as raw materials.

CAO Y, YANG S, XIE Y, CHEN Y, FANG X, CHEN K