国家/地区 中国（30）
IPC部 C（30）
IPC大类 C08（30）
IPC小类 C08K（30）
IPC C09K005/14（30）
发明人 GUO J（2） HUANG H（2） JIANG X（2）
LI J（2） LIN Y（2） LIU W（2）
LIU Y（2） WANG N（2） YANG X（2）
公开年 2021（9） 2022（8） 2023（4） 2018（3）
申请年 2022（8）  2020（6）  2021（5）  2019（4）  2018（3）  2011（2）  2015（2） 
专利权人 UNIV SOUTH C.（4） NINGBO INST .（2） UNIV ZHONGSH.（2）

Heat-conducting gel used for heat dissipation of electronic device, comprises silicone oil matrix, bisphenol-A-type epoxy resin and heat-conducting filler comprising modified graphene, modified diamond and modified carbon nanotubes, where surface of modified graphene is modified with amino group.

HE Y, LIU F, YU G

Preparing perovskite quantum dot/4-aminophenylporphyrin/graphene oxide high thermal conductivity composite film used in heat dissipation comprise coating toluene dispersion of perovskite quantum dots on 4-aminophenylporphyrin, and graphene oxide composite thermal conductivity film.

WANG S, LUAN Y

Electronic device such as chip, comprises electronic component, heat sink in which surface its is provided with magnetic layer containing permanent magnetic material, and composite thermal-conductive material comprising organic matrix and ferromagnetic particles.

FANG H, XU Y, ZHENG K

Composite material useful in field of electronic component comprises e.g. poly(butylene terephthalate), graphene micro sheet, carbon nanotubes, ethylene methyl acrylate glycidyl methacrylate terpolymer, gamma-aminopropyltriethoxysilane and vinyl acetate ethylene copolymer emulsion.

YI Q, LU J, WANG Z

Heat-conducting and wave-absorbing integrated flexible material useful in the field of electronics, communications, automobiles, medical appliances, household appliance products, aerospace, security monitoring and navigation.

WU W, YAO Q, WU L, YANG X, TONG G

Epoxy resin composite material, has multiple fluorinated graphene films located in epoxy resin base body, where multiple fluorinated graphene films orderly arranged along thickness direction and along length direction of epoxy resin base body.

PAN Z, ZHOU M

Preparing high thermal conductivity resin useful for PCB plug holes, comprises e.g. introducing thermally conductive filler and low dielectric loss resin into preheating machine, carrying out preheating treatment to it by preheating machine; weighing graphene, and passing into mixing drum.

NIE X

Thermally conductive wave absorbing silicone rubber composite material for use in the field of electronic communication, comprises vinyl silicone oil, hydrogenated silicone oil, graphene aerogel, ferrite powder, metal supported inorganic thermally conductive powders, platinum catalyst and inhibitors.

JIANG X, LIU W, GUO J

Heat-conducting and wave-absorbing nano-grade composite material for function-wide frequency spectrum, comprises heat conducting alumina powder, absorbing powder, medium ceramic powder, graphene, cross-linking agent, curing agent, catalyst, curing delay agent and rest of silicone oil carrier.

DENG S

Graphene film, which is not calendered, and graphene film has airtight bubble structure.

WANG N