国家/地区 中国（7）
IPC部 C（7） B（2）
IPC大类 C09（7） B27（2）
IPC小类 C09D（7）
IPC C09J011/04（7）
发明人
公开年 2022（7）
申请年 2022（7）
专利权人

Preparing medium-density plate useful as e.g. backing board for printed circuit board drilling, comprises e.g. placing formaldehyde and methyl phenol into reactor, adding potassium hydroxide to reactant, mixing, heating, reacting, adding aminopropyltriethoxysilane, and reacting.

LI F

Heat dissipation adhesive tape with high heat dissipation performance used for electronic product e.g. mobile phone and heat source with low power and small radiator, has surface heat dissipation layer, heat conduction base material and heat conduction adhesive layer arranged from top to bottom.

HAN K

Boron nitride-doped thermally conductive enhanced agent used for curing resin in preparation of adhesive or polymer coating, is prepared by peeling and grafting boron nitride by co-grinding of melamine and boron nitride, and reacting ground mixture and formaldehyde under alkaline condition.

WANG G, YAO X, JIANG S, SHAO L

Special aerogel mixed slurry for e.g. partilce board, comprises aerogel powder, adhesive, viscosity enhancer, titanium dioxide and distilled water, and has preset viscosity.

ZHANG X

Uniform heat radiating flameproof film useful in mobile phone battery, comprises: flameproof layer made of e.g. main resin A and flame retardant; soaking layer made of e.g. nano-silver slurry and aqueous polyurethane resin; and heat conducting layer made of e.g. main resin B, and curing agent.

LAI Z, FENG L, TU Y, LIANG X, LIU Z, ZHU X

Graphene thermal conductive ink used in composite material for thermal conductive adhesive used in thermal management, comprises graphene, aqueous polyacrylate, dispersant and solvent.

WU L, HUANG J, LIN Y

Paint useful in heat dissipation adhesive tape, comprises silicone modified acrylic resin, graphene composite heat-dissipation powder, dispersant, water and auxiliary agent.

LIU G