国家/地区 中国（8）
IPC部 C（8）
IPC大类 C09（8）
IPC小类 C09D（8）
IPC C09D007/80（8）
发明人
公开年 2020（8）
申请年 2020（7） 
专利权人

Preparing modified phenolic epoxy coating used in oil pipe, by adding functionalized reduced graphene oxide to solvent, adding diphenol-based propane epoxy resin to dispersion, adding diphenol-based propane epoxy resin, grinding and mixing.

FENG C, ZHU L, SONG Y, CAO Y

Graphene heat dissipation coating comprises graphene powder, solvent, water, resin, film forming auxiliary agent, dispersing agent, curing agent, antifoaming agent flatting agent, rust inhibitor, and flame retardant.

LI L, PAN Z, TAN H

Aqueous heat-conducting anticorrosive paint for metal surface treatment comprises bisphenol A epoxy resin emulsion, and mixture comprising fatty alcohol, additive, filler, three-dimensional graphene dispersion.

DI Y, XIE J, LI Y, XU Y, LIU R, ZHOU M, SONG Q

Graphene-metal-modified nano heavy-duty anti-corrosion coating comprises carbon fluoride, graphene, titanium powder, zinc powder, niobium powder, nickel powder, iron powder, additive, diluent, dispersant and epoxy resin.

WANG J, CAI P, XU X, WANG Y, PAN J, WANG Z, WU X

Graphene modified strong acid-alkali-resistant electroplating powder coating comprises e.g. unsaturated polyester resin, coumarone resin, isophorone, silicon powder, synergistic antioxidant, zinc phosphate tetrahydrate and leveling agent.

ZHOU C, LIANG Z, LI D

New water-borne epoxy zinc-rich primer is composed of A component and B component, where A component comprises zinc powder, graphene, hydrophilic solvent and aqueous epoxy curing agent, and component B is aqueous epoxy resin emulsion.

XU J

Photosensitive graphene oxide UV light curing architectural coating comprises photosensitive resin, photosensitive graphene oxide, reactive diluent, photoinitiator, modified glass beads, pigment and filler.

ZHENG J, YANG D

Antistatic floor coating comprises epoxy resin, diluent, graphene, carbon nanotube, wetting and dispersing agent as component A, and low-viscosity epoxy-based curing agent as component B.

WU S, LI C, PAN C