国家/地区 美国（10）
IPC部 C（10）
IPC大类 C08（10）
IPC小类 C08K（10）
IPC C09D163/00（10）
发明人 JI S Y（2） KIM S H（2）
公开年 2021（5）
申请年 2019（2）  2021（2） 
专利权人 SAMSUNG ELEC.（2）

Corrosion prevention composition for metal substrate, comprises sacrificial metal particles, where sacrificial metal particles comprise metal selected from nickel, molybdenum, or cobalt, and sacrificial metal particles are not passivated.

HAWKINS T, VIRTANEN J A

Coated substrate used in e.g. vehicles, bus bars and metal wires, contains first coating layer comprising electrodepositable coating layer, and second coating layer comprising powder coating layer on at least portion of first coating layer.

VISSER S J, WOODWORTH B E, GONDERJONES H, SCHNEIDER J R, MOORE K L, FOLLET M L, MA L, MUNRO C H, POLLUM M M, FRENCH M S, CONDIE A G, HARRISON A E, SCHWENDEMAN I G, DEI D K, BANCROFT C N, APANIUS C, SYLVESTER K T, DEDOMENIC C J, PUODZIUKYNAITE E, HOLLY G, AMII H, NOEL B C, CHRISTOPHER A, POLLUM J M M, GONDERJONES H A

Electromagnetic shield for electromagnetic interference shielding devices and materials, comprises substrate, conductive additive, and binder incorporated with the conductive additive and deposited on the substrate.

KANER R B, ELKADY M F, KAVANAUGH J, LAINE S, LKADIMACHEREF, JACK K

Preparing nanocomposite coating composition for antenna reflector, comprises e.g. preparing polymer resin by adding hardener to epoxy resin selected upon organic synthetic compound, and preparing mixture of pure graphene and acetone solvent using ultrasonic disperser.

RAFIEE R

Electrically conductive and corrosion resistant graphene-based coating composition used in substrates, comprises binder, graphene filler, and dispersing agent, where graphene filler comprises airless-sprayed expanded graphene stacks.

IJERI V S, GAYDOS S P, KINLEN P J, DHIRDE P G, KHANNA A

Graphene dispersant used in e.g. preparation of graphene composite powder, and graphene composite film, comprises polyaniline oligomer or derivative which is electroactive polymer, and combines with graphene via pi-pi bond.

DAI L, GU L, YU H, ZHENG Y, MA J, ZHAO H, LIU S, DING J

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S

Insulating composition for manufacturing substrate such as printed circuit board comprises graphene oxide and insulating material comprising graphene oxide; and polar solvent having specific solvent polarity index.

JI S Y, SEO S H, HAM S J, KIM S H, SOO Y J, SHANG H S, SUK J H, SEUNG H K

Semiconductor sealing material composition used as packaging material to protect electronic part e.g. diode comprises epoxy resin; hardener; curing catalyst; additive such as coupling agent; and nano-graphene plate powder as filler.

CHOI S, PARK S, CHOI S H, PARK S H, HONG C S, HUI P S

Resin composition for treating surface of steel sheet, comprises binder resin, graphene and solvent.

CHO J D, LEE J R, LEE J S, SHIM S E, LEE J, CHO J, SHIM S