国家/地区 中国（7）
IPC部 C（7）
IPC大类 C08（7）
IPC小类 C08K（7）
IPC C08L083/04（7）
发明人 WANG N（2）
公开年 2021（4） 2022（2）
申请年 2020（3）  2021（2） 
专利权人

Heat-conducting and wave-absorbing nano-grade composite material for function-wide frequency spectrum, comprises heat conducting alumina powder, absorbing powder, medium ceramic powder, graphene, cross-linking agent, curing agent, catalyst, curing delay agent and rest of silicone oil carrier.

DENG S

Graphene film, which is not calendered, and graphene film has airtight bubble structure.

WANG N

Preparation of heat conducting gasket used for electronic products by mixing phase change material, heat conducting filler, matrix material and crosslinking agent, performing curing crosslinking reaction, and freezing preform.

CHU W, JIANG N, LI M, YU J

Thermally conductive gasket comprises thermally conductive filler, which is two-dimensional thermally conductive filler arranged along thickness direction of gasket..

GE X, LI F, LI Z, SHI Y, ZHOU B

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Preparation of graphene reinforced thermal conductive composite film for electronic product, involves punching graphene film to form graphene film with closed bubble structure, coating fluidity-adjusted polymer on graphene film and curing.

WANG N

Electrically insulating and thermally conductive composition useful in electronic device e.g. computer, comprises resin, electrically insulating and thermally conductive powder, and graphene in specific amounts.

LIN C, WU M, CHIOU K, LIN C L, WU M J, CHIOU K C, LIN Z, QIU G