国家/地区 中国（5）
IPC部 C（6）
IPC大类 C25（6） C23（2）
IPC小类 C25D（6）
IPC C25D003/38（6）
发明人 LI S（2） ZHANG L（2）
公开年 2022（6）
申请年 2021（6）
专利权人

Optimized filling holes comprise modifying insulative inner wall of blind hole with reduced graphene oxide, depositing copper in blind hole through electroplating process, removing first dry film to expose copper foil, and removing exposed copper foil.

YANG N, YEH A

Heat-conducting graphene sheet filling hole copper-covering structure for use in electronic radiating field, has heat conducting graphene sheet whose upper and lower surfaces are uniformly coated with copper layer.

LIU Y, HUANG K, QIN F, WEI T

Preparing copper-chromium-zirconium alloy layered belt material with composite deformation of graphene/copper, involves subjecting bulk copper-chromium-zirconium alloy to solid solution treatment, carrying out room temperature iso-channel extruding, low temperature rolling, stacking and vacuum-aging.

WANG D, AN X, DU Q, WEI K, YAO L, WEI W

Preparing surface metal layer used in aerospace, electrical and electronic fields, involves e.g. coarsening, sensitizing and activating polyetheretherketone modified with carbon fiber, glass fiber, carbon nanotube and graphene, chemical plating and electroplating copper, and plating nickel.

ZHANG L, TONG X, WANG J, ZHANG J, WEN C, LI S, CUI Q, WANG X, XU J, FENG L, BAI J, LI J, WANG N

Electro-deposition copper-reducing graphene composite material used for measuring metronidazole used for treating e.g. trichomoniasis, involves dropping graphene dispersion liquid uniformly on bare glass carbon electrode, which is then dried at room temperature to obtain composite material.

PANG C, LI S, MA X

Processing uniform electroplating of inorganic non-metal base material useful in e.g. electronic device, comprises e.g. adding high-conductivity activated plating solution with circulating filtration system, placing substrate on annular cathode fixing frame, and plating.

ZHENG X, JIANG Z, ZHANG L