国家/地区 中国（19）
IPC部 C（19） B（4） H（4）
IPC大类 C25（19）
IPC小类 C25D（19）
IPC C25D005/00（19）
发明人 LI Z（3） GE Y（2） HU J（2）
LI J（2） LIU J（2）
公开年 2022（7） 2021（6） 2023（3）
申请年 2021（7）  2022（5）  2020（4） 
专利权人 UNIV DALIAN（2）

Preparation of magnesium alloy ultrasonic electrodeposition nano-nickel-based composite layer involves connecting magnesium alloy sample as negative electrode, and nickel plate as positive electrode respectively with pulse power supply, soaking in electroplating solution, and electrodepositing.

HU D, LI Z

Electroplating method for improving adhesion between conductive circuit and base material, involves providing substrate, forming conductive circuit on substrate by using conductive paste, obtaining pre-electroplating copper circuit.

SHAO J, REN Z, WANG J

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Electroplating plastic surface useful for door guard plate of automobile comprises mixing graphene, silicon dioxide sol, epoxy resin, curing agent and water, removing oil, spraying mixed slurry, carrying out chemical plating and electroplating, washing, and drying.

LI J, SUN L

Preparing nickel-graphene super-hydrophobic coating, comprises using metal substrate as cathode and nickel as anode, electroplating in plating solution, vacuum drying, obtaining nickel-graphene super-hydrophobic coating on surface of metal substrate.

YANG C, LI Z, WANG A, XING X, ZHANG R, LIU J, CUI G

Hardening stainless steel surface, involves taking sleeve base body after ultrasonic rolling, carburizing surface to form carburized layer, taking sleeve base body after carburization, and brightening surface to obtain finished product sleeve.

BIAN C

Surface treatment for reducing secondary electron yield of oxygen-free copper for e.g. radar, by performing ultrasonic cleaning on oxygen-free copper sheet, performing surface electrolysis treatment in copper sulfate solution, performing electrochemical deposition, and performing heat treatment.

GE Y, FU H, DU Y, PAN P, CAI J, ZHANG H, HAO J

Preparing composite plating layer useful in preparing electric contact material, comprises e.g. taking composite plating solution as plating solution, carrying out electric brush plating on surface of substrate to obtain composite plating layer and composite plating solution is silver nitrate.

MAO R, JIA L, YU J, HU J, HE C, YE Z, LIU X, CHEN W, TIAN X, PEI F

Preparation of nano-nickel-based composite layer involves filling plating solution in electrolytic tank, immersing nickel plate as anode and alloy steel substrate as cathode in plating solution, and co-depositing graphene oxide, titanium nitride nanoparticles and metallic nickel on substrate.

GE Y, MA C, LIU C, SONG W, LI Z

Plating of metal bipolar plate includes mixing modified synthetic resin with high conductivity material to obtain coating slurry and applying coating slurry on metal bipolar plate.

YE H