国家/地区 中国（6） 美国（3）
IPC部 C（9）
IPC大类 C25（9） H05（9）
IPC小类 C25D（9）
IPC H05K003/18（9）
发明人 DU W（2） PAN Z（2） YANG N（2）
YEH A（2）
公开年 2019（2） 2021（2） 2022（2）
申请年 2018（2）  2019（2） 
专利权人 SHANGHAI DIB.（2） TRIALLIAN CO.（2） YEH A（2）

Optimized filling holes comprise modifying insulative inner wall of blind hole with reduced graphene oxide, depositing copper in blind hole through electroplating process, removing first dry film to expose copper foil, and removing exposed copper foil.

YANG N, YEH A

Preparing negative charge oxidation graphene, comprises adding concentrated sulfuric acid in reaction container, adding graphite powder, persulfate and phosphorus oxide, and adding concentrated sulfuric acid into graphite solution.

SONG T, CHEN W, PAN Z, LIU Z

Device for printing circuit board by graphene, has conductive foil electrode line connected with metal foil sheet set in insulating plate assembly, and graphite sheet whose top end is connected with graphite sheet electrode line.

DU W

Device for manufacturing nano-circuit board, comprises insulating material barrel, where top surface of insulating material barrel is provided with transverse supporting one and transverse supporting two with longitudinal supporting one.

DU W, DU M

Directly plating circuit board based on graphene film comprises e.g. heating graphene oxide containing a specific functional group, dispersing heat-treated graphene oxide in an aqueous solution, ultrasonically stirring and centrifuging.

ZHOU Q, SONG W, LIU G, PAN Z, HU G, WEI Z

Printed circuit board (PCB) with graphene-metal composite material as conductive line for motor, has underlying conductive wire that is provided on surface of substrate sheet and has graphene-metal composite layer.

HUANG Y, LIU H, ZHENG X

Method for modifying walls and bottoms of holes with reduced graphene oxide, involves providing substrate with copper cladding layer and drilled holes, while modifying walls and bottoms of holes with reduced graphene oxide.

YEH A, YANG N, YEH D, YANG F

High-conductivity electrical interconnect structure for electrically interconnecting electrical components, has metallic overlay portion that connects peripheral edges of graphene elements with each other.

TANIELIAN M H

Preparing graphene thin-film material with controllable conductivity useful in electrical devices, electrodes and other fields, involves performing pretreatment, oxidation, reduction, modification and membrane measurement processes.

NIU Y