国家/地区 中国（6） 美国（2）
IPC部 B（8）
IPC大类 C25（8） B05（2） B22（2）
C09（2）
IPC小类 C25D（8）
IPC C25D005/18（8）
发明人
公开年 2021（4） 2022（2）
申请年 2021（4）  2022（2） 
专利权人

Resin-modified coating useful for glove mold, prepared by forming foam layer on the surface of the old aluminum mold through multiple deposition processes, and spraying the modified resin.

SHEN H, DING Z

Preparation of copper-tungsten graphene-containing composite material for vacuum switch electric appliance, involves preparing tungsten-copper-graphene core-shell powder, and sintering obtained graphene core shell powder.

DING Y, ZHU Z, LIANG S, ZOU J, XIAO P, CHEN Z, ZHANG Q, DENG N

Layered composite material used as heat conducting material comprises graphene layer and metal copper layer.

HU W, DENG Y, QIN Z, CHEN J, WU Z

Blind hole filling using reduced graphene as seed layer comprises pre-processing drilled circuit board, removing glue residue and forming manganese dioxide layer, forming graphene oxide layer on surface of polyaniline layer and reverse pulse electroplating.

XIE H, LUO Z

Preparing magnesium alloy conductive coating used in military electronic equipment, involves cutting magnesium alloy block, stir friction processing on magnesium alloy pre-treated surface and preparing electrochemical coating containing polyaniline and graphene on magnesium alloy surface.

YU Z, ZHANG X, ZHENG Y

Fabricating non-enzyme sensor element used in non-enzyme sensor, involves printing conductive material on surface of substrate to form working, reference and auxiliary electrode, and printing porous carbon material on working electrode.

LIN Y, LIN S, CHEN Y, WANG H, WANG H Y, CHEN Y Y, LIN S H, LIN Y S

Preparing double-pulse electroplating nickel-graphene composite plating layer of continuous casting crystallizer comprises processing crystallizer copper plate before electroplating, and preparing graphene oxide solution by Hummers method.

FENG T

Method for transferring graphene on substrate used in electronic device, involves depositing graphene on side of metal substrate, and stacking target substrate on metal substrate-graphene layer to form stacked structure.

GONG K