国家/地区 日本（4） 中国（3） 欧洲专利局（EPO）（3） 韩国（2） 美国（2）
IPC部 C（6）
IPC大类 C23（6）
IPC小类 C25D（6）
IPC C01B031/02（4） B82Y040/00（2） C01B031/04（2）
C23C018/16（2） C23C018/20（2） C23C018/31（2）
C23C018/40（2） C23C028/00（2） C25D005/10（2）
C25D005/56（2）
发明人 BAE A H（2） HWANG T S（2） LEE J H（2）
NAM J D（2） OH J S（2） SON S I（2）
公开年 2013（3） 2011（2）
申请年 2011（6）
专利权人 JX NIPPON MI.（2） SAMSUNG ELEC.（2）

Resin plating method during manufacture of e.g. electronic equipment, involves forming graphene thin layer on resin substrate by applying expanded graphite dispersion to resin substrate and electroplating resin substrate.

BAE A H, SON S I, NAM J D, LEE J H, HWANG T S, OH J S

Copper foil for manufacture of graphene for e.g. transparent electrode, conductive thin film of display element, mercury-free fluorescent lamp and carrier of drug delivery system, includes specified amount of preset plane on surface.

KOBIKI T, SAKAGUCHI K, KOHIKI M

Copper foil used for graphene manufacture, consists of copper plating layer containing hydrogen in ratio above preset value, and having glossiness above preset value in rolling parallel direction and right angle direction.

CHIBA Y

Producing graphene oxide nanoplatelets and derived products, comprises e.g. dosing e.g. a hydrocarbon or mixture of hydrocarbons, placing dosed compounds inside a furnace, and obtaining intermediate material comprising carbon nanofilaments.

MERINO S C, MARTIN G I, VARELA R H, MERINO A M D P, MERINO SANCHEZ C, MARTIN GULLON I, VARELA RIZO H, MERINO AMAYUELAS M D P, RIZZO H V, SANCHEZ C M, OMARYERAS M D P M, GULLION I M

Resin plating comprises forming a graphene thin layer on a resin substrate and electroplating the resin substrate having the graphene thin layer formed on it.

BAE A H, SON S I, NAM J D, LEE J H, HWANG T S, OH J S, LEE H, EAH H B, SANG I S, JAE D N, JOON S O, JUN H L, TAE S H, HWANG T, LEE J, NAN J, PAE A, SUN S, OU J

Preparation of graphene film involves obtaining electroplated copper substrate, growing graphene on substrate by heating under normal pressure by chemical vapor deposition using methane and mixed gas of argon and hydrogen and cooling.

LI T, WANG W, WANG Y, ZHOU Y