国家/地区 中国（20） 美国（9） 世界知识产权组织（6） 日本（4） 韩国（4） 欧洲专利局（EPO）（3） 印度（3） 俄罗斯（3） 加拿大（2） 法国（2） 台湾（2）
IPC部 C（28） B（13） H（10）
G（2）
IPC大类 C23（28）
IPC小类 C25D（28）
IPC C25D015/00（13） B82Y030/00（9） B82Y040/00（6）
C23C028/00（5） C23C018/12（4） C23C016/26（3）
C23C018/52（3） C23C028/04（3） C25D003/12（3）
C25D005/00（3） C25D005/10（3） C25D009/04（3）
C25D013/02（3） H01L021/02（3） H01M004/04（3）
发明人 ESAULOV S K（3） ESAULOVA TS V（3） GUO C（3）
LAI H（3） CHEN K（2） GABEN F（2）
LI J（2） LI X（2）
公开年 2021（17） 2020（9） 2023（2）
申请年 2020（28）
专利权人 ESAULOV S K（3） ESAULOVA TS .（3） GUANGZHOU UL.（3）

Plating layer structure of zinc-nickel alloy plating layer without chromium passivation and hydroxyl graphene, has chromium-free passivation layer prepared by silane passivation agent.

LAI H, CHEN K, GUO C

Dull nickel-plated and graphene-enclosed plating structure for zinc alloy die-casting parts, has zinc-nickel alloy plating layer that is prepared from inside to outside sequentially zinc alloy base portion.

LAI H, CHEN K, GUO C

Manufacture of lithium-ion battery used for e.g. phone and laptop, involves e.g. depositing dense layer comprising anode, cathode and/or electrolyte, by supplying substrate and suspension of non-agglomerated nanoparticles of material having preset size, and performing densification of dried layer.

GABEN F

Manufacture of dense layer of electrochemical device, involves providing substrate and suspension of non-agglomerated nanoparticles of material having specific particle size distribution, depositing layer on substrate, drying and densifying.

GABEN F

Coating electrical current collector involves treating portion of surface of electrical current collector with adhesion promoting composition to deposit treatment layer over portion of surface of electrical current collector.

HELLRING S D, FURAR E A, ORLER H L, OAKES L J

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

High adhesion fingerprint-resistant hot-dip galvanized steel sheet comprises e.g. middle substrate, first galvanized layer, first passivation solution, first fingerprint resistant layer, second galvanized layer and second passivation layer.

GONG K

Doping method involves stacking sacrificial layer on doped layer, arranging doping material on the sacrificial layer, arranging electrodes on doping material and doped layer, and doping doping material into doped layer.

SON K, KIM T, SON A

Protective layer structure of non-cyanide cadmium plating and electrophoretic painting comprises metal substrate, non-cyanide cadmium plating layer, phosphate layer and electrophoretic paint coating comprising hydroxyl graphene material.

GUO C, PENG C, LAI H

Connector e.g. male connector, comprises electrical contact material containing metal base material and conductive coating layer containing phase made of metal other than gold, and phase made of gold or non-metallic conductive material.

KUBO T, OKADA M, SHIMIZU T, KAWAI H, KAWAI Y