国家/地区 中国（12） 美国（2）
IPC部 C（14） B（6） H（3）
A（2）
IPC大类 C23（14）
IPC小类 C23C（14）
IPC C23C014/35（4） C23C028/00（3） B82Y030/00（2）
B82Y040/00（2） C23C014/02（2） C23C016/26（2）
C23C028/02（2） C25D003/38（2） C25D007/00（2）
发明人 LI X（2） ZHU Z（2）
公开年 2023（14）
申请年 2022（14）
专利权人

Branched nano-wire array composite photoelectric film used for photo cathode protection, has composite heterojunction system cadmium sulfide/reduced graphene oxide quantum dots/titanium dioxide branched nanowire array composite photoelectric film.

HOU B, LU G, SUN M, JIANG X

Silver-graphene composite plating layer, has layer main body provided with first nano-silver layer, silver-graphene layer and second nano-silver layer that are sequentially arranged on base body.

LI H, ZHAO K, ZHANG Q, CHEN B, GUO W, ZHU Z, ZHANG C, DING Y, PANG Z

Method for metallizing surface of graphene film in electronic device, involves plating metal adhesive layer on surface of graphene film base body by magnetic control sputtering method, and plating metal plating layer on surface of metal adhesive layer by electroplating method.

LIAO Q, LI Y, XU L, JI H, WANG X, MA S, ZHANG Y

Polypropylene based composite current collector useful in battery of electric device, comprises polypropylene layer, modified layer and metal layer arranged in stack, where modified layer formed by grafting hydroxy-terminated acrylate and layered double metal hydroxide onto polypropylene layer.

ZHANG G, LI X, XIA J, WANG S, ZHU Z

Improving tribological property of titanium substrate through electrophoretic deposition involves using titanium substrate that is pure titanium substrate, coating pure titanium substrate with graphene nanoplatelets at deposition parameters, and annealing, where pure titanium substrate is cathode.

MALLICK M, ARUNACHALAM N

Metal particles used in adhesive paste or solder paste for composite bonding structure for semiconductor device, comprises core including metal and shell on surface of core, where shell comprises metal and nanoparticles.

CHU K, LEE J, JUNGHOON L, CHU K M

Method for preparing composite mask plate in electronic device processing field, involves setting photo-etching pattern on mask plate, removing part of photoresist, removing remaining photoresist with cleaning solution, cleaning laser opening residue, and drying mask plate to finish preparation.

CAI J, JIANG C, ZHUANG M, WU J, ZHAO W, YAO Q

Plating layer structure for preparing chromium-free black conversion film, comprises metal substrate, and zinc-iron alloy plating layer sequentially from inside to outside on metal substrate.

LAI H, GUO C, LI X

Copper foil graphite sheet comprises copper foil, graphene layer continuously deposited on copper foil surface, and nickel-plated layer which is distributed in non-continuous island shape between copper foil and graphene.

CHEN S, CAO F, WANG B

Aircraft engine component used as gearboxes, comprises wall comprising aluminum alloy and/or magnesium alloy, and protective coating comprising prime layer, silicone elastomer layer and abrasion resistant layer covering surface of wall.

IURLARO S, GARGIOLI A, GARABELLO M, GAROFALO S, GILARDI E, PICA O, ARGENTIERI G