国家/地区 世界知识产权组织（7）
IPC部 C（7）
IPC大类 C23（7）
IPC小类 C23C（7）
IPC B82Y030/00（3） H01M004/04（3） B01J035/00（2）
B01J037/02（2） B22F001/02（2） B82Y040/00（2）
C23C002/00（2） C23C016/02（2） C23C018/12（2）
C25D011/02（2） C25D013/02（2） C25D015/00（2）
H01L021/02（2） H01M004/13（2） H01M004/139（2）
发明人 GABEN F（2）
公开年 2021（7）
申请年 2020（6） 
专利权人

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Manufacture of lithium-ion battery used for e.g. phone and laptop, involves e.g. depositing dense layer comprising anode, cathode and/or electrolyte, by supplying substrate and suspension of non-agglomerated nanoparticles of material having preset size, and performing densification of dried layer.

GABEN F

Manufacture of dense layer of electrochemical device, involves providing substrate and suspension of non-agglomerated nanoparticles of material having specific particle size distribution, depositing layer on substrate, drying and densifying.

GABEN F

Coating electrical current collector involves treating portion of surface of electrical current collector with adhesion promoting composition to deposit treatment layer over portion of surface of electrical current collector.

HELLRING S D, FURAR E A, ORLER H L, OAKES L J

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

Composition useful as catalysts and electrodes, comprises a nanoporous carbon powder comprising nanopores having disposed in it copper metal nanostructures and an elemental copper nanowires.

NAGEL C J, BRODEUR C L, NAZEL C A J, BRODARD C L

Enhancing surface adhesion of polyetherimide for metal plating involves contacting sulfuric acid with polyetherimide substrate surface to form pre-etched substrate, and contacting substrate with sulfuric acid and periodate ions mixture.

NARUSKEVICIUS L, HYMAN M