国家/地区 世界知识产权组织（9）
IPC部 C（9）
IPC大类 C25（9）
IPC小类 C25D（9）
IPC C25D003/38（3） C25D015/00（3） H01M004/04（3）
B01J035/00（2） B01J037/02（2） B22F001/02（2）
B82Y030/00（2） C23C002/00（2） C23C018/12（2）
C25D005/00（2） C25D005/54（2） C25D013/02（2）
H01L021/02（2） H01M004/13（2） H01M004/139（2）
发明人 GABEN F（2）
公开年 2021（9）
申请年 2020（5）  2021（3） 
专利权人

Composite copper foil structure used for copper-clad laminate and printed circuit board, has shell layer comprising N-layer graphene layer and M-layer metal copper layer alternately laminated with each other, and where surface of shell layer close to copper foil core layer is graphene layer.

GAO F, CAI L, ZHANG Q

Manufacture of lithium-ion battery used for e.g. phone and laptop, involves e.g. depositing dense layer comprising anode, cathode and/or electrolyte, by supplying substrate and suspension of non-agglomerated nanoparticles of material having preset size, and performing densification of dried layer.

GABEN F

Manufacture of dense layer of electrochemical device, involves providing substrate and suspension of non-agglomerated nanoparticles of material having specific particle size distribution, depositing layer on substrate, drying and densifying.

GABEN F

Coating electrical current collector involves treating portion of surface of electrical current collector with adhesion promoting composition to deposit treatment layer over portion of surface of electrical current collector.

HELLRING S D, FURAR E A, ORLER H L, OAKES L J

Preparing bright high-conductivity graphene/copper complex material comprises e.g. preparing graphene/copper deposition liquid, adding gelatin and sodium dodecyl sulfate as additive, adding polyacrylamide and thiourea, and depositing.

WEI K, WANG S, WEI W, CHU F, DU Q

Producing composite material used for e.g., electrocatalysis by impregnating a two-dimensional (2D)-material based aerogel with impregnation solvent, performing a solvent/water exchange, performing precursor diffusion and passing a current.

YANG W, MOISSINAC F, BARG S, BYUN J J, FRANCIS M, BARGZUELEN, GRADE S

Cover for electronic device, comprises substrate comprising metal, insert molded plastic on surface(s) of substrate, passivation layer or micro-arc oxidation layer, coating composition, outmold decoration layer, and chamfered edge.

WU K, CHANG C H, CHEN Y Y

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Copper coating for reducing resistance losses and increasing energy efficiency in conductors and devices where copper is used as conductor by coating charged graphene oxide particles in suspension by the electrophoretic storage method.

SAKAR M