国家/地区 中国（7）
IPC部 B（7）
IPC大类 B05（7） C25（7） C23（4）
H01（3） C09（2）
IPC小类 B05D（7）
IPC B05D003/02（7）
发明人
公开年 2021（3） 2022（2） 2023（2）
申请年 2021（4）  2022（2） 
专利权人

Forming substrate in substrate hole used in plating technology involves pre-processing surface of insulating base material and hole structure, coating graphene dispersion, applying different rotation radius and different rotating speeds to insulating base and plating material with conductive layer.

XIANG Q, YE G, CAO X, ZHANG J, LU J, MA Y, ZHENG K

Resin-modified coating useful for glove mold, prepared by forming foam layer on the surface of the old aluminum mold through multiple deposition processes, and spraying the modified resin.

SHEN H, DING Z

Acid cleaning process of corrosion resistant stainless steel belt comprises performing solid solution treatment on stainless steel plate, annealing once, finish rolling, and secondary annealing and performing four stages of coating treatment.

YU C, JI F, XING Y, ZHANG X, WU M, LI Y, WU B, WANG Y, SHAN C, BEN H

Plating of metal bipolar plate includes mixing modified synthetic resin with high conductivity material to obtain coating slurry and applying coating slurry on metal bipolar plate.

YE H

Blind hole filling using reduced graphene as seed layer comprises pre-processing drilled circuit board, removing glue residue and forming manganese dioxide layer, forming graphene oxide layer on surface of polyaniline layer and reverse pulse electroplating.

XIE H, LUO Z

Manufacture of dense layer of electrochemical device, involves providing substrate and suspension of non-agglomerated nanoparticles of material having specific particle size distribution, depositing layer on substrate, drying and densifying.

GABEN F

Preparing anode foil by heating and treating corroded foil, using forming solution for perform forming of corroded foil, coating graphene solution on surface of forming foil, sintering and performing phosphating treatment on forming foil.

LIU G, HUANG H, WU Q, HUO J, OU K, CHEN Y, FENG Z, YANG F