国家/地区 中国（17） 世界知识产权组织（4） 台湾（3） 韩国（2） 美国（2）
IPC部 F（25）
IPC大类 F28（25）
IPC小类 F28D（25）
IPC F28D015/04（25）
发明人 CAI J（2） CHEN W（2） CHEN X（2）
CHEN Y（2） DU H（2） GAO Y（2）
GUO Z（2） HA J S（2） HAJUNSEOK（2）
HAO Z（2） LEE S H（2） LIU Z（2）
LV J（2） RHO H K（2） RYU H S（2）
公开年 2021（7） 2022（7） 2020（4） 2017（3） 2023（2）
申请年 2020（9）  2021（6）  2016（3）  2022（3）  2019（2） 
专利权人 GUANGDONG MO.（2） SHENZHEN YUS.（2） UNIV CHONNAM.（2）

Manufacturing heat spreader with metal graphene composite structure, by manufacturing heat panel by forming metal powder layer by spraying metal powder on prepared metal substrate, and heating and injecting graphene fuel to form a heterostructure, and shaping heat panel.

LEE S H, RHO H K, RYU H S, HA J S, HAJUNSEOK

Metal graphene composite structure heat pipe has porous wok in which graphene layer is formed on surface of inner pores, and metal plating layer formed on outer surface of porous wok by metal plating of porous wok.

HA J S, RHO H K, RYU H S, LEE S H, HAJUNSEOK

Directional hydrophobic structure for electronic packaging drainage device, has directional hydrophobic spacer that is arranged on substrate, and micro-grooves that are discharged into packaging mold along tapered micro-pillars.

LI B, GUO Y, XIE B, WEN G, CHEN Y, OU Z, HOU M

Porous 3D graphene structure used as porous wick medium in thermal systems such as vapor chambers or heat pipes used in electronic devices to enhance thermal performance.

KOSAR A, KAYA I I, SADAGHIANI A K, APAK A, APAK A M, PARLAK M, TASTAN U, BOENCUE M

Bidirectional heat conduction fast graphene capillary tube main body, has graphene whose end is fixedly connected with mechanism, where connecting graphene mechanism on main body of tube is matched with another connecting mechanism.

LIU H, LI X, WANG J, YU F, CHEN X

Preparation method of nano liquid absorbing core for intelligent product or electronic product, involves taking metal core and in situ growing graphene with hydrophilic functional groups on surface of the metal core.

JIA Y, WU Q, MA Y

Method for preparing medium transmission core in heat pipe for use in mobile phone, computer and other electronic products, involves reducing graphene oxide films by performing flame firing process, and performing high temperature thermal reduction process.

SU D, TANG Z, LU J, ZHOU R, ZHOU B

Integrally formed heat equalizing plate for radiating field, has graphene plate provided with vacuum cavity, where vacuum cavity is filled with fluid working substance, where periphery of graphene plate is subjected to hot pressing sealing task.

LIU Z, LV J, HAO Z, GAO Y, CAI J

Vacuum cavity soaking plate for heat equalizing plate, has upper layer plate and lower layer plate, which are sealed into vacuum cavity, and made of graphene material, and liquid absorbing core made of porous graphene material.

LIU Z, LV J, HAO Z, GAO Y, CAI J

Flat heat pipe for use in heat dissipation of high power electronic device, has graphene interconnection array arranged in silicon carbide closed flat shell and for vertically growing with microporous structure of upper and lower inner surface of contact carbide close flat shell.

ZHANG Y, ZHAO Q