国家/地区 美国（8） 中国（5） 世界知识产权组织（3） 日本（2） 韩国（2）
IPC部 C（13）
IPC大类 C23（13）
IPC小类 C23C（13）
IPC H01B001/02（6） H01B001/04（6） C23C016/26（4）
H01B005/14（4） H01B013/00（4） B32B009/00（2）
C01B032/186（2） C23C014/16（2） C23C014/35（2）
C23C016/32（2） C23C026/00（2） C23C028/00（2）
H01B001/24（2） H01R013/03（2）
发明人 KUBO T（2） SHIMIZU T（2）
公开年 2021（7） 2022（5）
申请年 2021（13）
专利权人 YAZAKI CORP（2）

Electrical connection component for e.g. electric contact, comprises base material and nanocarbon material film composed of graphene laminated material formed by laminating two layers of graphene single layer materials.

KITANO A, SHIMIZU T, KUBO T

Laminate used for electronic device such as display device, comprises substrate, layer containing compound having condensed polycyclic hydrocarbon structure, and layer containing conductive material.

NAOYA N, KAZUNORI T, NOSAKA N, TAKANASHI K

Preparing copper-based graphene useful for preparing copper-based graphene conductor of electric wire cable, comprises performing surface cleaning and drying on copper material, stacking with high temperature resistant substrate, annealing, and growing graphene layer on copper material surface.

FU J, YANG J, SHEN H, ZHANG W, MA Y

Multilayer electrically conductive wire for use in aeronautics field to lighten airplane, has central support core, set of pairs of layers around central support core comprising intercalary layer made of non-carbon based material and graphene layer, and first layer arranged on outer surface.

LEKARSKI K

Forming bulk product utilized for forming real-world components, involves coating particulate conductive phase material with binder phase using deposition coating process, and forming coated conductive phase material into bulk material.

SHEEDY P, SCHMIDT W R

Preparing power transformer by drawing metal wire rod, laminating and edging rod, static cooking rod, electrodepositing metal strip, depositing second metal and graphene layer, insulating electrodeposited strips, and coupling strips.

TAGLIAFERRI V, UCCIARDELLO N, GENNA S, PREDA R

Corrosion prevention composition for metal substrate, comprises sacrificial metal particles, where sacrificial metal particles comprise metal selected from nickel, molybdenum, or cobalt, and sacrificial metal particles are not passivated.

HAWKINS T, VIRTANEN J A

Conductive structure, comprises conductive material layer including metal and work function control layer including two-dimensional material with defect, to control work function of conductive structure.

LEE C, KIM C, LEE E, BYUN K, KIM S, SHIN H, SHIN H J, BYUN K E, LEE C S, LI C, JIN C, LI Y, JIN S, SHEN X

Surface modified copper bus bar, has lapping surface and non-overlapping surface of copper bus are attached with silver bottom layer by magnetic control sputtering technology.

LIN Q, MEI Z

Encapsulate used to connect electrical and thermal connections has liquid metal core of liquid metal having mercury, indium and/or gallium and/or alloy having mercury, tin, indium and/or gallium and lead, antimony, cadmium, bismuth, aluminum, zinc, silver, gold and/or thallium and shell.

CREIGHTON M A, MORRIS N J, FARRELL Z J, TABOR C E