国家/地区 中国（6） 台湾（3） 美国（3）
IPC部 F（8）
IPC大类 G06（8） H05（5） F28（4）
H01（4） F16（2）
IPC小类 G06F（8） H05K（5） H01L（4）
F28D（3）
IPC G06F001/20（8）
发明人
公开年 2021（8）
申请年 2020（5）  2021（2） 
专利权人

Mobile phone back shell, has semiconductor refrigerating sheet whose back side surface is provided with radiating hole, where front side of back shell main body corresponding to hole is fixedly adhered with waterproof ventilating film.

CHEN X

Graphene computer radiating fan, has fan blade fixedly connected with fan body, where side of filling layer is connected with supporting layer, and lower side of supporting layer and graphene lower film layer are bonded.

GUO X, HUANG S, LI A

Heat conductive device for use in an electronic device, such as mobile phones, comprises a heat conductive unit provided with a closed chamber, a wick structure arranged on an inner side surface of the closed chamber, and a heat conductive fluid is arranged in the closed chamber.

CHENG C, WEI S, JUANG Z, HSIEH C

Thermal exchange assembly used e.g. in computing platform e.g. laptop, comprises cold plate configured to be placed on semiconductor device and including window section, and heat pipe directly coupled to cold plate and including window.

CARBONE M, HUTTULA J, MISHRA C, PAAVOLA J

Heat dissipating device, disposed on circuit board, comprises first glue layer, disposed on circuit board, first graphene composite heat dissipating layer, second glue layer, second graphene composite heat dissipating layer, and resin layer.

CHANG C F

Electrostatic driven double-layer solid-state refrigeration device based on electric card effect comprises e.g. PET dielectric layer arranged with graphene electrode arranged at bottom part of uppermost insulating polyimide tape.

MA R, BO Y, ZHANG Q

Heat conduction structure used in mobile device, has two heat conduction layers and metal microstructure that form stacked structure and stacked structure that is divided into two sections in direction along axis of heat conducting unit.

XIAO Y, HE M, SHIAU Y

Temperature adjustable refrigeration device, has cold-conducting bonding layer and heat-conducting bonding layer whose material made of grapheme, silver, nano-copper powder, silicone grease and liquid metal.

NI M, ZHU J, LIAO Y