| 国家/地区 |
美国(7)
|
| IPC部 |
H(7)
C(4)
G(4)
|
| IPC大类 |
H01(7)
C01(2)
C09(2)
C23(2) |
| IPC小类 |
H01L(7)
C01B(2)
C09K(2)
C23C(2) H01S(2) |
| IPC |
C23C016/26(2)
H01L031/0224(2)
H01L031/101(2)
H01L051/50(2) |
| 发明人 |
SHIN H(4)
KIM S(3)
SHIN H J(3)
CHO Y(2) HWANG K(2) KIM H(2) LEE C(2) LEE C S(2) |
| 公开年 |
2022(7)
|
| 申请年 |
2022(7)
|
| 专利权人 |
SAMSUNG ELECTRONICS CO LTD(7)
|
SHIN H, NIU W, MUELLEN K, LIU J, WU F, FENG X, KIM S, LIANG P, WHOOPENG, MULLEN K, WENHUI N, SHIN H J
LEE C, SHIN H, OH Y, KIM T, LEE M, HYUN L, OH Y T, SHIN H J, LEE C S
KIM S, BYUN K, CHO Y, SHIN K, LEE E, LEE C, SONG H, SHIN H, YOON J, LEE S, LIM H, BYUN K E, CHO Y C, SHIN K W, LEE C S, SONG H J, SHIN H J, SU Y J, LEE S Y, LIM H S, LI Z, YOUN J, SHEN X, LI C, LI Y, ZHAO L, JIN S
HWANG K, CHOI H, KIM J, KWAK S, JEONG J, BAEK S, KIM S, BAIK M, JUNG Y, SIK C Y, BAEK M H, JUNG J H, KIM J H, CHOI H H, HWANG K Y
HONG S, PARK J, KIM H, KIM D, HWANG J, HWANG K, HWANG K W, HWANG J S, KIM H J, HONG S W
HAN Y, CHUNG W, CHO Y, KANE W S, SONG X, SINHA A K, CHO Y J
