国家/地区 美国（47）
IPC部 C（47）
IPC大类 C23（47）
IPC小类 C23C（46） C01B（21） H01L（19）
H01M（6） B22F（5） C01G（5）
B01J（4） B82Y（4） C22C（4）
H01J（4） C30B（3） G03F（3）
B23Q（2） B32B（2） C09D（2）
IPC C23C016/26（22） C01B032/186（11） C23C016/02（11）
C23C016/455（10） H01L021/02（8） H01L021/285（8）
C23C016/44（6） C01B032/184（5） C01B032/194（5）
H01L021/768（5） B82Y040/00（4） C23C016/04（4）
C23C016/40（4） H01M010/0525（4） B22F003/24（3）
发明人 SHIN H（5） BYUN K（4） SHIN H J（4）
SHIN K（4） BYUN K E（3） LEE C（3）
NAVEH D（3） SHIN K W（3） CHEN Y（2）
CHO Y（2） CHUNG J H（2） GUINEY I（2）
HANSANG K（2） KIM S（2） KWON H（2）
公开年 2022（47）
申请年 2021（22）  2022（22）  2020（3） 
专利权人 SAMSUNG ELEC.（6） APPLIED MATE.（3） UNIV BARILAN（3） IND TECHNOLO.（2）
MELLANOX TEC.（2） PARAGRAF LTD（2） SK ON CO LTD（2） UNIV CALIFOR.（2）
UNIV PUKYONG.（2） UNIV SUNGKYU.（2）

Vacuum processing apparatus for removing oxidizing gas, comprises decompressable process container, supply port that is formed on side wall of process container and configured to supply, to process container, and apparatus also comprises ionic liquid that absorbs oxidizing gas.

HAYAKAWA T, UMESHITA N, AKIYAMA K, SEKIGUCHI K, ASAKO R, NAKANO T, ARYAL D, ROTONDARO A, IWASHITA M, IIZUKA Y, UEDA H

Conductor material, has metal matrix, first carbon allotrope distributed within metal matrix, where first carbon allotrope is aligned with direction of electric current flow through length of metal matrix, and metal matrix and first carbon allotrope have electrical interfacial coherency.

KRAFT F F

Digital formation of two-dimensional materials structures used for electronic components, involves generating donor substrates containing back surface and front surface, applying coating to front surface, and irradiating coating containing donor material.

ZERGIOTI I, PAPAZOGLOU S, ZACHARATOS F, LOGOTHETI A, PESQUERA A, ZURUTUZA A, NAVEH D

Repairing layers of laminate stack or printed circuit board, comprises providing layered structure, identifying fault location in outer graphene layer, preparing surface of outer graphene layer, and applying localized heat on fault location.

MENTOVICH E, ATIAS B, NAVEH D, LEVI A, SMOLINSKY E Z B

Mechanism for moving substrate carrier through chemical vapor deposition system, has moveable arm for operating in chamber including first pressure and temperature, and motor located outside chamber in environment including second pressure.

NAVEH D, STERN C, BENNAIM Y, ISMACH A, KAUFMAN T, BARRABI E, MENTOVICH E, ROTEM Y, GRIDISH Y

Material for hole transport layer of light emitting device, has deposited film whose potential gradient of surface potential is in specific range.

WATABE T, SEO H, UEDA L, KAWANO Y, TOMOHIRO K A, KITANO Y, DOS T, OHSAWA N, SEO S, TOSU T, KUBODA T, UEDA A, KONO Y, KUBOTA T, TORISU T, OSAWA N

Metal-graphene composite comprises metal layer and graphene layer provided by growing directly on one surface of metal layer, where graphene layer contains two and/or more graphene thin, metal layer is copper, nickel, cobalt, iron, manganese, chromium, vanadium, titanium, platinum, gold and aluminum.

KIM D J, HONG B H, WOO Y S, KIM D, YU Y S

Manufacturing electrostatic chuck having high heat dissipation property, high resistance to thermal shock and lightness, involves preparing composite powder by ball-milling aluminum or aluminum alloy powder and carbon-based nanomaterial powder, preparing electrode layer and forming dielectric layer.

KWON H, HANSANG K

Manufacturing electrostatic chuck having high heat dissipation property, involves preparing composite powder by ball-milling aluminum or aluminum alloy powder and carbon-based material powder, manufacturing multilayer billet, extruding and forming dielectric layer.

KWON H, HANSANG K

Preparing nanoparticles on a substrate for composite, involves depositing micro-sized particles or salt precursors on a substrate, and applying a rapid, high temperature thermal shock to the substrate and the micro-sized particles or the salt precursors.

YAO Y, CHEN Y, HU L