国家/地区 中国（6）
IPC部 B（6）
IPC大类 C22（6）
IPC小类 C22F（6） B22F（4） C22C（3）
C23C（3） H01B（3） C21D（2）
IPC C22F001/08（6）
发明人
公开年 2022（6）
申请年 2021（3）  2022（3） 
专利权人

In-situ interface modification method of graphene copper-based composite material involves adding copper powder after annealing and reduction into mixed solution of carbon source and copper salt in oil bath heating environment, and coating carbon source with copper ion powder.

ZHANG D, LI Z, PENG Y, DONG Z, XIONG D

Method for preparing metal-graphene composite material by using electronic component, involves preparing metal-graphene composite material by hot-pressing sintering, and applying pulse current to metal substrate to perform surface heat treatment to metal substrate.

WANG X, HUO Y, LI J, CAO Z, XIAO Z

Preparing copper alloy semiconductor lead frame for circuit board, comprises heating copper alloy ingots, removing oxide, aging, adding copper alloy semi-finished product silver plating bath for silver-plated plating treatment, and activating.

CAO G, LI C, XU J, YIN H

Preparing copper-based graphene useful for preparing copper-based graphene conductor of electric wire cable, comprises performing surface cleaning and drying on copper material, stacking with high temperature resistant substrate, annealing, and growing graphene layer on copper material surface.

FU J, YANG J, SHEN H, ZHANG W, MA Y

Preparing metal-based composite material involves preparing graphene preparation solution, performing low-energy ball milling to oxidized graphene, cold pressing mixed powder into sheet blank, and annealing in reducing furnace in hydrogen atmosphere.

FENG Y, CHEN L, MA J

Copper-based iron-based composite electro contact material for switch electric appliance and electronic instrument instrument, comprises ferric oxide graphene, ferroferric oxide, ferric chloride solution, and copper base material.

ZHENG Y