国家/地区 中国（10）
IPC部 C（10）
IPC大类 C08（10）
IPC小类 C08K（10） C08L（10） H05K（9）
C09K（5） H01B（3） C08G（2）
C09D（2） H01L（2）
IPC C08K003/04（10）
发明人 CHI S（2） JI S Y（2） KIM S（2）
KIM S H（2） LI S（2）
公开年 2021（3） 2018（2） 2022（2）
申请年 2021（3） 
专利权人 SAMSUNG ELEC.（2）

Epoxy resin composite material, has multiple fluorinated graphene films located in epoxy resin base body, where multiple fluorinated graphene films orderly arranged along thickness direction and along length direction of epoxy resin base body.

PAN Z, ZHOU M

Silicon rubber wave-absorbing compound material useful for electronic appliance, communication, power battery, and military industry, comprises vinyl silicone oil, hydrogen-containing silicone oil, wave-absorbing filler, reinforcing filler, platinum catalyst, and inhibitor.

JIANG X, YAN X, GUO J

Preparing graphene electromagnetic shielding material used for producing outer material for cables, involves mixing graphite, graphene and carbon fiber materials, uniformly mixing to obtain mixture, and stirring mixture uniformly.

LI W, LI S, HU S, FAN N

Graphene oxide aerogel-based electromagnetic shielding polymer composite material with a conductive-heat-conducting double network structure comprises aerogel filled with liquid silicone rubber/boron nitride filler through casting process.

DUAN H, REN W, LIU Y, YANG Y, ZHAO G

Preparing electromagnetic shielding material based on ordered nanostructure reinforced polyethylene comprises e.g. assembling magnetic particles on surface of carbon nanotubes and graphene and assembling in polyethylene of ordered structure.

GAO M, MENG L

Processing boron fiber reinforced unsaturated resin sheet forming and stress measurement comprises e. g. forming graphene powder by modifying graphene with silane and adding graphene powder into acetone solution.

WANG A, LI J, NIU Q, LI S, LI N

Preparation of absorption material involves modifying graphene oxide to obtain modified graphene, adding resin and carrier to modified graphene and then uniformly mixing and curing.

INVENTOR U

Molding composition for a semiconductor package comprises a liquid crystal thermosetting polymer resin and graphene oxide.

JI S Y, KIM S H, CHI S, KIM S

Insulating layer composition for use in substrate of insulating prepreg or insulating film and printed circuit board, comprises soluble type liquid crystal thermosetting oligomer, metal alkoxide compound, and graphene oxide.

JI S Y, HAM S J, KIM S H, KIM D Y, YEONG J S, JIN H S, HWAN K S, YEONG K D, CHI S, KIM S, KIM D, HAM S, CHI S Y, HAMSUKJIN

Electrically insulating and thermally conductive composition useful in electronic device e.g. computer, comprises resin, electrically insulating and thermally conductive powder, and graphene in specific amounts.

LIN C, WU M, CHIOU K, LIN C L, WU M J, CHIOU K C, LIN Z, QIU G