国家/地区 中国（16）
IPC部 C（16）
IPC大类 C08（16） C09（16） C01（3）
H05（3） B29（2） B82（2）
H01（2）
IPC小类 C08K（16）
IPC C08L083/04（16）
发明人 LI Z（2） LIU Y（2） WANG N（2）
公开年 2021（11） 2020（4）
申请年 2020（16）
专利权人

Graphene film, which is not calendered, and graphene film has airtight bubble structure.

WANG N

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

High heat-conducting and insulating silicone grease comprises base silicone oil, modified silicone oil, heat conducting filler, modifier and auxiliary agent comprising polyvinyl alcohol, tetraethoxysilane and hexamethyldisiloxane.

LEI J, XU J, ZHANG L, LI Z, YAN D

Heat conducting interface material useful in electronic product and/or automobile field comprises heat-conducting film layer compounded on first resin layer and second resin layer compounded on heat-conducting film layer.

WANG Y

Dopamine modified boron nitride thermal conductive silicone grease, is prepared by weighing dopamine modified boron nitride powder and silicone oil, mixing, placing in ball milling tank, taking out samples, ball milling and degassing.

LV S, CHEN P, ZHAO C, MO D

Preparing a complex thermal interface material based on three-dimensional graphene comprises e.g. preparing oxide-modified graphene complex hydrogel by self-assembly method, and preparing three-dimensional graphene complex aerogel.

TAN H, PAN Z

Method for preparing insulating graphene thermally conductive gasket comprises using modifier with amino groups, modifying graphene oxide with modified insulating filler, compounding, using orienter to defoam and orientate.

YAO L, LIU Y, LIU M, ZHENG J, ZHANG K

Preparing hybrid double-coated boron nitride/graphene insulating and thermally conductive silicone grease, by adding boron nitride to solvent, adding alcohol, organic solvent and graphene, distilling and mixing with organosilicone.

ZHANG C, RAN W, LI Z

Heat conducting gasket comprises fillers, which are orderly arranged in inclined manner, and are formed by mixing polymer matrix and heat conducting fillers, where heat conducting fillers comprises anisotropic heat conducting fillers.

MIAO J, WU Q, LI W, ZHOU A, XUE D, YANG Q, DAI C, FU Z

Low-temperature resistant polymer insulating and thermally conductive composite material comprises e.g. high-density polyethylene, micron silicone oil lubricant epoxy resin matrix, curing agent, polypropylene resin and polyimide.

DU C, JIA X, WANG W, YU H, YAN Y