国家/地区 日本（20）
IPC部 C（20）
IPC大类 C08（20）
IPC小类 C08K（20） C08L（18） C08G（6）
C08J（6） C09K（5） B29C（4）
D01F（4） H01L（4） B32B（3）
B33Y（3） B82Y（3） C09D（3）
H01B（3） B29B（2） B41M（2）
IPC C08K003/22（20）
发明人 ZHANG J（3） FARRAR G J（2） HU N（2）
HU N X（2） LIU D（2） REDDY M M（2）
TANG Y（2） XU R（2）
公开年 2021（11） 2022（3） 2016（2）
申请年 2021（7）  2020（6）  2019（3）  2015（2） 
专利权人 CPK INTERIOR.（2） FUJI POLYMER.（2） JINAN SHENGQ.（2） JINAN SHENGQ.（2）
XEROX CORP（2）

Polymer molded article used for improving communication speed of electronic device, comprises polymer material, silicon fine particles, nanocarbon powder, and calcium powder.

MARUO S

Matter composition comprises epoxy functionalized two-dimensional shaped particles comprising functionalized graphene, clays, and alumina platelets, carbon nanotubes, epoxy resin, and curing agent comprising ionic liquid, and 1-ethyl-3-methylimidazolium dicyanamide.

KALB J, IFTIME G, WEI J, PANDEY R, RAHULPANDY, JUNHUA W, JAMIKALB

Thermoplastic polyolefin composition for slush and rotary-molded article e.g., interior component of automotive vehicle, comprises olefin-block copolymer, polypropylene copolymer, adhesion promoter, sulfur-free stabilizer additive and talc.

FARRAR G J, REDDY M M

Antiviral material for destroying viruses, including coronaviruses and decreasing risks of viral infection, comprises polymeric matrix and graphene particles dispersed in polymeric matrix.

REDDY M M, FARRAR G J

Intermediate film used for laminated glasses for automobiles, railroad vehicles, aircraft, ships, and buildings, contains pigment.

NOHARA A, CHOU K, NAKAYAMA K, OKAJIMA M, CHOW K, MOYURU O A, ZHANG J, YE Y

Flowable hardenable composition used in electronic heat sink assembly, comprises shaped composite particles, having thermal filler particles having specific aspect ratio retained in binder matrix, dispersed in hardenable binder precursor.

PEREZ M A, MARTINEZ J A

Resin composition useful in electronic component for communication, comprises molded portion having electromagnetic wave absorber.

UCHIDA K, TSURUMI H, TSURUMI K, NEI T, HIROKAZU T

Composition for coating and for forming a coating on substrate e.g., surface of boat or ship comprises epoxy-functional monomers, diluent, and sufficient amount of hydrophobicity-modifying additive that is reactive in epoxide polymerization.

GAIER M, ALGERMOZI M, RODIONOV I

Silicone resin composition used for composite material for heat conductive silicone sheet for electronic component, comprises silicone resin and heat resistance improving agent comprising organic polycyclic aromatic compound containing secondary amino groups and ketone groups in cyclic structure.

MAKOTO I, KATSUYUKI S, YUJI N, IWAI M, SUZUMURA K, NAKAJIMA Y, NAKASHIMA Y

Ionic polymer used in polymer composition for forming electrolyte for electrode of electrochemical cell, comprises repeating unit which is obtained by reacting functional groups-containing compound and metal bis(halosulfonyl)imide compound.

DAIGLE J, LAROUCHE A, CHAREST P, GUERFI A, DONTIGNY M, ARMAND M, HINTENNACH A, ZAGHIB K, CHARREST P, DONITY M