国家/地区 美国（11）
IPC部 F（11）
IPC大类 F28（11） H01（6） H05（6）
B32（4） B82（4） C22（4）
C23（4） C01（2） C08（2）
C09（2） C25（2）
IPC小类 F28F（11） H05K（6） B32B（4）
C22C（4） C23C（4） H01L（4）
B82B（2） B82Y（2） C01B（2）
C08J（2） C09K（2） C25D（2）
H01B（2）
IPC F28F021/08（11）
发明人 JANG B Z（2） LIN Y（2） ZHAMU A（2）
公开年 2019（3） 2014（2） 2016（2） 2018（2）
申请年 2018（4）  2014（3） 
专利权人 NANOTEK INST.（2）

Radiating table designed with special water channel of alloy material, has heat dissipation pipe fitting to water pipe through groove, heat dissipation platform provided with several waterway annular grooves communicated with water pipe through groove.

ZHAO J, HU C, HU C Q, ZHAO J H

Metal matrix nanocomposite used as e.g. load-bearing element, comprises metal or metal alloy containing gold and silver as matrix material, and multiple graphene sheet chosen from pristine graphene material or non-pristine graphene material.

ZHAMU A, LIN Y, JANG B Z

Producing metal matrix nanocomposite by preparing graphene dispersion, bringing the graphene dispersion in physical contact with solid substrate surface, and depositing layer of metal or metal alloy onto surfaces of aligned graphene sheets.

ZHAMU A, LIN Y, JANG B Z

Condensing apparatus used for petrochemical industry, has condenser which has coolant side and condensing side, substrate which is formed on coolant side or condensing side, and layers of graphene which are formed on substrate.

LI C, CHANG W, PENG B

Forming graphene-doped aluminum composite for thermal management component i.e., avionics chassis, heat spreader, heat sink, heat exchanger, radiator, or heat pipe, by crystallizing aluminum around substantially uniformly dispersed graphene.

BLAND A, RAINBOW A J, SIDGWICK D H, SMITH M J, BRAND A, LINBO A J

Method for manufacturing heat spreader for printed wiring board, involves depositing layer of metal on layer of molybdenum and joining first and second graphene sheets to each other by alloy bonding first and second metal layers.

STARKOVICH J A, TICE J B, ZENG X, KOSTELEC A D, PENG H, SILVERMAN E M

Composite structure comprises organic resin, carbon fiber and flat graphene nanosheets embedded in resin.

LUTZ M, TANZILLI D, BURGER N, LAACHACHI A

Graphene-based thermal management core for printed wiring boards (PWB) used for electronics applications, e.g., consumer electronics, has first or second reinforcement layer which includes substrate impregnated with non-dielectric resin.

SCHNEIDER D, DAVIS W E

Composite material used for thermal-conducting material for thermal management of collagen, comprises metal matrix and graphene platelets dispersed in the metal matrix with random orientation.

KIM N P

Heat-dissipating sheet used for electronic device, consists of metal layer, graphene layer, protective layer, adhesive layer, and release layer in contact with surface of adhesive layer, and has preset thermal conductivity.

LEE M, JEONG H, LEE M H, ZHENG X