国家/地区 美国（27）
IPC部 H（27） C（14） B（11）
G（6） F（4） A（2）
IPC大类 H05（27）
IPC小类 H05K（21） H01L（6） B32B（5）
C01B（5） H01B（5） C08K（4）
C09K（4） H05B（4） B82Y（3）
H01Q（3） C08G（2） C08J（2）
C08L（2） C09D（2） G01N（2）
IPC H05K007/20（8） H05K009/00（8） C08K003/04（4）
H05K001/02（4） B32B009/00（3） B82Y040/00（3）
C01B032/198（3） C09K005/14（3） H01L023/373（3）
H05K001/09（3） H05K001/11（3） B32B003/26（2）
B32B007/12（2） B32B027/28（2） C01B032/19（2）
发明人 CHOI C（2） PARK J（2）
公开年 2022（27）
申请年 2021（27）
专利权人

Circuit board structure, has dielectric layer provided on circuit layer, and build-up circuit layer exposing non-conductive seed layer region and electrically connected to pads through conductive via and conductive seed layer region.

CHEN K, KUO C, CHEN G, GUO J

Optimized filling holes comprise modifying insulative inner wall of blind hole with reduced graphene oxide, depositing copper in blind hole through electroplating process, removing first dry film to expose copper foil, and removing exposed copper foil.

YANG N, YEH A

Thin encapsulating mounting structure for evaporation and heat dissipation applications for electronic component, has specific thin film portion whose one surface is fixed to fixing portion, and preset thin film portion, fixing portion and specific thin film portion that are assembled.

LU J, LUGECHI, LU J Q

Electromagnetic interface (EMI) shielding material comprises polymer matrix and van der Waals material is embedded in polymer matrix, forming quasi-one-dimensional atomic threads, where van der Waals material is trichalcogenide compound.

KARGAR F, BALANDIN A A

Heat dissipation sheet comprises e.g. graphite layer, primary graphene layer stacked on one side of graphite layer with primary adhesive layer interposed there between and secondary graphene layer stacked with secondary adhesive layer.

PARK J, YOUNG C, CHOI C Y, PARK J U, CHOI C, PIAO Z

Transparent electrode for electronic device, has conductive silver-containing layer and conductive oxide layer that are laminated in this order, and transparent electrode that is provided with sulfur-containing silver compound layer.

SHINODA N, NAITO K, SAITA M, KATSUYUKI N, NAOMI S, YUTAKA S, SAITA Y, SHIDA N

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Passive radiating alternating current (AC) power supply for information technology (IT) device, has power unit that is connected with inner heat conducting component in heat transfer manner to lead generated heat into power supply shell.

LU Q

Polymeric positive temperature coefficient (PPTC) tank heater comprises first conductive region comprising first conductive surface coupled to first lead; and second conductive surface coupled to second lead; heater body.

FAGANELLO D, CHEN J, ZHOU Z, FU Y

Mechanical meta-structure based electromagnetic wave absorber, has unit cell provided with carbon black, carbon nanotube, carbon fiber and graphene, where dielectric loss of absorber is controlled by changing strut diameter.

PARK J W, KEUN S, KYOUNG J, LEE K S, CHOI J H, LIM D, CHOIWONJUN, CHOI W, CHOI J, LEE K, JUN E, SONG J, PARK J