国家/地区 中国（11） 世界知识产权组织（2）
IPC部 C（11）
IPC大类 C08（11）
IPC小类 C08L（11） C08K（9） C08J（7）
H05K（7） C09D（4） H05B（4）
B32B（3） C09K（2）
IPC C08L063/00（11）
发明人 WANG N（2）
公开年 2021（8） 2022（2）
申请年 2020（11）
专利权人

Halogen-free low-dielectric epoxy resin composition useful in laminated plate and printed circuit board, comprises e.g. dicyclopentadiene epoxy resin, cresol novolac epoxy resin, maleimide resin, and 9,10-dihydro-9-oxa-10-phosphaphenan-threne-10-oxide-bisphenol phenolic resin hardener.

CHEN K, YU D

Graphene film, which is not calendered, and graphene film has airtight bubble structure.

WANG N

Flexible metal-based graphene electric heating material, comprises flexible insulating layer, flexible graphene resistance layer, flexible insulating layer, and metal substrate arranged sequentially from top to bottom.

LI Y, LOU M

Electroplating of metal on surface of insulating base material for printed circuit board, involves mixing resin and solid filler to obtain resin coating, coating conductive substance forming film and placing in plating solution.

LAI Z, LIANG X, ZHAO T, LIU D, SUN R

Preparation of graphite aerogel-based composite thermal interface material involves preparing ascorbic acid solution, adding graphene oxide aqueous solution, compressing prepared sample, pouring polymer solution, and demolding dried sample.

ZHANG X, GUO X, ZHANG Y, CHENG S, CAI J

Flexible rigid circuit board comprises middle core board, copper foil layer arranged on both sides of core board, environmentally-friendly solder resist layer, blind groove, and inner groove arranged in vertical direction of blind groove.

LI J

Preparing copper wire net-based graphene heating film comprises adding epoxy resin, curing agent, graphene micro powder and polytetrafluoroethylene micro powder, heating and curing.

ZENG J, CHEN Q, ZHANG J, SI W, BAI T

Graphene multilayer circuit board heating chip comprises epoxy resin glass fiber plate as substrate layer, electrode layer connected with graphene layer, and epoxy resin glass cloth as top layer.

CHEN L

Prepreg with absorbing and electromagnetic shielding composite function comprises prepreg resin mixture comprising resin matrix, toughening agent and wave-absorbing powder, fiber layer and shielding layer.

JING D, WEI X

Preparation of graphene reinforced thermal conductive composite film for electronic product, involves punching graphene film to form graphene film with closed bubble structure, coating fluidity-adjusted polymer on graphene film and curing.

WANG N