国家/地区 中国（12） 世界知识产权组织（12） 日本（10） 韩国（9） 台湾（9） 美国（8） 欧洲专利局（EPO）（4） 印度（2）
IPC部 C（24）
IPC大类 H01（24）
IPC小类 H01L（24）
IPC H05K007/20（14） H01L023/373（10） C08K003/04（5）
H01L023/36（5） C09J011/04（4） H05K009/00（4）
B32B009/00（3） C09J011/08（3） C09J133/08（3）
C09J163/00（3） C09J201/00（3） C09K005/14（3）
H01L023/367（3） B29C070/62（2） B29C070/88（2）
发明人 ICHIKAWA I（3） ISAO I（3） TAKEO Y（3）
YOSHINOBU T（3） HE M（2） HUANG C（2）
HUANG H（2） MATSUMOTO T（2） NAITO T（2）
SHIRATORI K（2） TSUKADA Y（2） YAJIMA A（2）
公开年 2022（14） 2021（8） 2023（2）
申请年 2021（24）
专利权人 LINTEC CORP（3） CTRON ADVANC.（2） NISSAN MOTOR.（2） TOKYO ELECTR.（2）

Heat dissipation sheet useful for display component comprises heat dissipation layer formed of polymer sheet containing graphene particles, and first adhesive layer located on top of heat dissipation layer.

YOO T H, LEE J, JOH B J, PARK M W, PARK M, CHO B, LIU T

Improved electromagnetic interference (EMI) shielding composition for synthesizing zinc ferrite nanoparticles ferrites by co-precipitation method, comprises composites containing graphene oxide blended ferrites.

BASU S, NAIR R U, SAHU A K, PATTNAIK S, CHOUDHURY B, MOHAPATRA M

Thermally conductive film for heat dissipation structure, is formed by arranging binder and scale-like carbon materials formed by graphene layers, and making portion(s) of minor axis of binder and minor axes of spaces formed by carbon materials and binder smaller than minor axis of carbon materials.

NAITO T, TSUKADA Y, KENEKO T, YAJIMA A, SHIRATORI K

Heat conductive film used for head-up display, is configured by disposing scale-like carbon material formed by graphene layers such that adjacent scale-like carbon materials contact each other, and such that major axis of scale-like carbon material is oriented in surface direction of film.

KANEKO T, NAITO T, TSUKADA Y, YAJIMA A, SHIRATORI K

Heat dissipation structure for use in electronic device, has heat dissipation module placed on surface of carrier, and including covering heating element, where setting position of module corresponds to heating element.

HE M, HUANG H, HUANG C

Thermally conductive adhesive composition used in electronic devices, comprises adhesive resin and graphene having two-dimensional structure.

TAKEO Y, ISAO I, YOSHINOBU T, ICHIKAWA I

Transparent electrode for electronic device, has conductive silver-containing layer and conductive oxide layer that are laminated in this order, and transparent electrode that is provided with sulfur-containing silver compound layer.

SHINODA N, NAITO K, SAITA M, KATSUYUKI N, NAOMI S, YUTAKA S, SAITA Y, SHIDA N

Thermal conductive structure comprises thermally conductive metal layer, and structural layer arranged on thermally conductive metal layer, where structural layer is stacked structure formed by graphene layer and ceramic material layer or structural layer is graphene-mixed ceramic material layer.

HUANG H, HUANG C, HE M, HANCHANGHUANG, HE M X, HUANG J K, HUANG H Z, WANG H

Forming film by carrying substrate having recess into processing container, placing on mounting table provided in processing container, using plasma of mixed gas containing inert gas and carbon-containing gas, while applying high frequency bias, and forming graphene film on substrate.

SUGIURA M, MATSUMOTO T

Patterning method for manufacturing of a desired pattern of an electrically conducting, semiconducting or insulating material on a substrate,.

LEPPAENIEMI J, SNECK A